A method for manufacturing a multi-layer PCB board with a groove-type buried copper block

Abstract

The invention discloses a method for manufacturing a multi-layer PCB board with groove-type embedded copper blocks, which includes pretreating the copper blocks; fixing the prepared conductive and heat-conducting materials on the first surface of the copper blocks; One inner layer core board...Nth inner layer chips are arranged in sequence, and prepregs are arranged between adjacent inner layer core boards to form core board parts, and the other inner layer core boards and prepregs except the first inner layer core board Through holes are provided at the corresponding positions on the top to form a through groove; the copper block is put into the through groove so that the conductive and heat-conducting material is located between the first surface of the copper block and the first inner core board, and pressed together; according to Recesses need to be milled in the first inner chip and copper block. By using special conductive and heat-conducting materials and a unique operation method, the present invention relatively easily realizes the design purpose of the groove of the traditional power amplifier, avoids the quality risk of tin climbing in the traditional method of assembly, and solves the traditional method of mandatory graphics Problems and limitations of electroplating.

Description

Technical field [0001] The present invention belongs to the technical field of PCB plate making, and more particularly to a multilayer PCB plate fabrication method for groove type buried copper blocks. Background technique [0002] At present, the production of a multilayer amplifier printed circuit board for groove type buried copper block is widely used to complete the processing of PCB and combined with graphic electroplating, so that the copper block, the core plate and the semi-solidified sheet are pressed, first controlled The copper block groove is deep milling. After the electroplating is completed, the side wall copper with a deep milling of the deep milling mill is used, so that the power amplifier high-speed pattern and ground layer are broken, and reduce the amplifier welding Tin ultrasound short-circuit risk. The disadvantages of this method include: [0003] 1) The copper block and the RF double panel above it are large copper surfaces, which use traditional FR4 mat...

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Problems solved by technology

[0007] In view of the above problems, the present invention proposes a multi-layer PCB board with recessed buried copper blocks and its manufacturing method, which can avoid the quality risk of tin creeping in the traditional method of assembly, and solve the problem of the traditional method of mandatory pattern electroplating. troubles and limitations

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