Flexible circuit three-dimensional printing device for high-molecular liquid-state metal co-printing

Abstract

The invention discloses a flexible circuit three-dimensional printing device for high-molecular liquid-state metal co-printing. The flexible circuit three-dimensional printing device comprises a mounting framework, a coaxial spray head mounted in the mounting framework, a material supply device, a receiving device and a three-dimensional motion mechanism for driving the coaxial spray head to perform three-dimensional motion relative to the receiving device, and further comprises an auxiliary curing device which synchronously moves with the coaxial spray head to spray printed and discharged materials. The flexible circuit three-dimensional printing device is characterized in that the coaxial spray head comprises inner and outer liquid-state metal charge cavity and high-molecular charge cavity which are independent from each other, and an inner spray head and an outer spray head which communicate with corresponding guide cavities separately and are coaxially arranged. XYZE four-axis motion is utilized for realizing printing of a three-dimensional structure, and the auxiliary curing device, a heating device and a bearing unit convenient for separating printed products solve the problem that a silica gel material is difficult in curing and is difficult to separate. The flexible circuit three-dimensional printing device is convenient to operate, and can quickly and directly print out a complete three-dimensional flexible circuit structure with liquid-state metal therein.

Description

technical field [0001] The invention relates to the field of flexible circuit manufacturing, in particular to a three-dimensional printing device for flexible circuits co-printed with polymer liquid metal. Background technique [0002] Flexible electronic devices are new types of electronic devices based on flexible materials, which have the characteristics of light weight and variability, and have broad application prospects in many aspects. Therefore, flexible electronics has developed rapidly, and advanced research results have been achieved, such as flexible circuit boards, flexible displays, flexible antennas, flexible memristors, and flexible sensors. [0003] All these flexible electronic devices are composed of flexible substrates and conductive materials. At present, the substrate materials used in flexible circuits are mainly polymers, and the conductor materials used mainly include conductive polymer materials, carbon-based small molecule conductive materials (gr...

AI Technical Summary

Problems solved by technology

This kind of manufacturing method has complex steps, cumbersome process, low production efficiency, and high requirements for the operation of the infusion process. It is very easy to cause insufficient liquid metal infusion due to small mistakes in the infusion process, which will further lead to circuit breakage and failure, which is not conducive to large-scale industrialization. mass production

Images