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Hermetic metal-ceramic housing for 60GHz applications

A ceramic shell and airtight technology, which is applied in the direction of electrical components, semiconductor/solid-state device parts, semiconductor devices, etc., can solve the problem of large insertion loss, achieve low insertion loss, large power capacity, and realize airtight packaging Effect

Active Publication Date: 2019-12-10
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention proposes a metal-ceramic housing and design method applied to 60GHz, and its purpose is to overcome the problem of excessive insertion loss of the current housing due to dispersion, resonance and other reasons in the millimeter wave frequency band

Method used

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  • Hermetic metal-ceramic housing for 60GHz applications
  • Hermetic metal-ceramic housing for 60GHz applications
  • Hermetic metal-ceramic housing for 60GHz applications

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Embodiment 1

[0032] An airtight metal-ceramic casing applied to 60GHz. The casing is composed of a metal heat sink, a metal frame and a ceramic insulator. The RF transmission channel of the casing adopts a rectangular waveguide-microstrip line transition structure, specifically: through the metal heat sink Make a rectangular hole on the top to form a vertical rectangular waveguide, and make a slot on the long side of the rectangular waveguide, solder the ceramic insulator in the slot of the rectangular waveguide through solder, and then weld the frame and the heat sink, on the top of the rectangular waveguide form a short circuit. Among them, the ceramic insulator is a microstrip-stripline-microstrip structure. The microstrip line on one side acts as a probe to excite the required transmission mode in the rectangular waveguide, and the microstrip line on the other side acts as a probe. It is used to interconnect with the chip, and the role of the middle strip line is to achieve airtight pa...

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Abstract

The present invention is an airtight metal-ceramic shell applied to 60 GHz, the structure of which includes a metal heat sink, a metal frame and a ceramic insulator; wherein, the metal heat sink is designed with four screw fixing holes and two vertical There is a rectangular waveguide in the direction of the rectangular waveguide. There is an opening on each of the long sides of the rectangular waveguide. Ceramic insulators are embedded in the opening of the rectangular waveguide. The metal frame is connected to the metal heat sink to form a shell for packaging 60GHz chips; the high-frequency signal transmission channel adopts The waveguide-microstrip transition structure converts the TE wave of the rectangular waveguide into the quasi-TEM wave of the microstrip line, so that the signal is transmitted from the external circuit to the chip inside the shell. Advantages: 1. The housing uses a rectangular waveguide as the input and output ports, which can be more conveniently interconnected with external circuits, and can achieve low insertion loss and large power capacity. 2. The ceramic insulator adopts a ceramic-metal-ceramic structure, which can not only play the role of waveguide-microstrip conversion, but also realize airtight packaging.

Description

technical field [0001] The invention relates to a 60GHz airtight metal-ceramic casing, which belongs to the field of chip packaging. Background technique [0002] With the development of 5G communication, satellite communication and other technologies, there are more and more millimeter wave chips. [0003] What follows is that the demand for millimeter-wave housings is also increasing. However, due to dispersion, resonance and other reasons, the RF transmission structure of traditional microwave housings has too large insertion loss in the millimeter-wave frequency band, which cannot meet the requirements of packaged chips. Therefore, for millimeter wave chips, bare chip packaging technology is mostly used now, but this method cannot meet the high reliability requirements of aviation and aerospace. Contents of the invention [0004] The present invention proposes a metal-ceramic housing and a design method for 60GHz, and its purpose is to overcome the problem of excessiv...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/552
CPCH01L23/552
Inventor 李永彬施梦侨程凯
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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