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Preparation method of electronic ceramic powder for apparatus element

A technology for electronic ceramics and electrical components, which is applied in the field of preparation of electronic ceramic powder for electrical components, can solve the problems affecting the performance of electronic ceramics, unevenness, and the particle size of the powder is not fine enough, and achieves lower temperature, better performance, and better ceramic performance. The effect of dense structure

Inactive Publication Date: 2018-07-03
QINGDAO XIANGZHI ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The preparation methods of electronic ceramics are various, and the preparation process is mostly similar. In the preparation process, the preparation of electronic ceramic powder has a great influence on the performance of electronic ceramics, and the general powder preparation method has powder particle size that is not fine enough and uneven. And other problems, seriously affect the performance of electronic ceramics

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment 1

[0013] A preparation method of electronic ceramic powder for electrical components, the specific preparation steps are:

[0014] (1) Preliminary crushing and grinding: add the prepared and mixed ceramic powder to 0.6 times the water of its own mass, and after stirring for 5 minutes, put it into a rod-type stirring mill equipment and grind for 2 hours;

[0015] (2) Drying and granulation: Dry the ground slurry at 140°C for 3 minutes, then put it into a spray drying equipment for drying and granulation, the drying temperature is set at 300°C, and the moisture content of the particles after drying is 2%-4%;

[0016] (3) Pre-firing: put the prepared ceramic particles into a pre-fired kiln for 2 hours and set the calcination temperature to 800°C;

[0017] (4) Secondary grinding: After the pre-fired ceramic material is air-cooled to 100°C, put in water that is 1 times the mass of the ceramic material and let it cool for 10 minutes, stir for 5 minutes, and then put the stirred slurr...

specific Embodiment 2

[0018] A preparation method of electronic ceramic powder for electrical components, the specific preparation steps are:

[0019] (1) Preliminary crushing and grinding: add the prepared and mixed ceramic powder to 0.8 times the water of its own mass, stir for 8 minutes, and put it into a disc-type stirring and grinding device for grinding for 3 hours;

[0020] (2) Drying and granulation: Dry the ground slurry at 160°C for 5 minutes, then put it into a spray drying equipment for drying and granulation, the drying temperature is set at 300°C, and the moisture content of the particles after drying is 2%-4%;

[0021] (3) Pre-firing: put the prepared ceramic particles into a pre-fired kiln for calcination for 3 hours, and set the calcination temperature to 900°C;

[0022] (4) Secondary grinding: Air-cool the pre-fired ceramic material to 150°C, put in water 1.2 times the mass of the ceramic material and let it cool for 12 minutes, stir for 8 minutes, and then put the stirred slurry...

specific Embodiment 3

[0023] A preparation method of electronic ceramic powder for electrical components, the specific preparation steps are:

[0024] (1) Preliminary crushing and grinding: add the prepared and mixed ceramic powder to 0.7 times the water of its own mass, and after stirring for 6 minutes, put it into the ring gap type stirring and grinding equipment for grinding for 2.5 hours;

[0025] (2) Drying and granulation: Dry the ground slurry at 150°C for 4 minutes, then put it into a spray drying equipment for drying and granulation, the drying temperature is set at 300°C, and the moisture content of the particles after drying is 2%-4%;

[0026] (3) Pre-firing: put the prepared ceramic particles into a pre-fired kiln for calcination for 2.5 hours, and set the calcination temperature to 850°C;

[0027] (4) Secondary grinding: Air-cool the pre-fired ceramic material to 130°C, put in water 1.1 times the mass of the ceramic material and let it cool for 11 minutes, stir for 7 minutes, and then...

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PUM

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Abstract

The invention discloses a preparation method of electronic ceramic powder for an apparatus element. The preparation method comprises the specific steps: (1) carrying out initial crushing and grinding,namely adding water into the prepared mixed ceramic powder to be blended, and putting the ceramic powder in stirring and grinding equipment to be ground; (2) carrying out drying granulation, namely after drying the ground slurry, putting the slurry in spray drying equipment to be dried and granulated; (3) carrying out pre-sintering, namely putting the prepared ceramic microparticles in a pre-sintering kiln to be calcined; and (4) carrying out secondary grinding, namely after air-cooling the presintered ceramic material, putting the same in water to stand and be cooled and mixed, then puttingthe mixed slurry in a ball mill to be ball-milled to obtain the electronic ceramic powder. The preparation method disclosed by the invention has the beneficial effects that the process system is reasonable in parameter setting, the obtained electronic ceramic powder is fine in granularity, the follow-up calcining temperature can be reduced, and a presintering process is also introduced, so that the calcined ceramic structure is more compact and better in performance.

Description

technical field [0001] The invention relates to the technical field of electronic ceramic preparation, in particular to a method for preparing electronic ceramic powder for electrical components. Background technique [0002] Electronic ceramics refer to ceramics that can use electricity and magnetism in the electronics industry. Electronic ceramics are ceramics with new functions obtained through precise control of surface, grain boundary and size structure. It is essentially different from general power ceramics in terms of chemical composition, microstructure and electromechanical properties. The main reason is that it has high mechanical strength, high temperature and high humidity resistance, radiation resistance, dielectric constant changes in a wide range, dielectric loss tangent value is small, capacitance temperature coefficient can be adjusted, dielectric strength and insulation resistance are high, and excellent aging properties. [0003] The preparation method...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/626
CPCC04B35/6261C04B35/62645C04B35/62655C04B35/62695
Inventor 不公告发明人
Owner QINGDAO XIANGZHI ELECTRONICS TECH CO LTD
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