Heat dissipation device for integrated circuit board and integrated circuit board using heat dissipation device

Abstract

The invention relates to a heat dissipation device for an integrated circuit board. The heat dissipation device can be mounted on the integrated circuit board to lead out heat from the integrated circuit board. The heat dissipation device includes a mounting unit, a heat exchange unit and a cooling unit; the mounting unit is used for mounting the integrated circuit board; the heat exchange unit isfixed below the mounting unit and is provided with a heat exchange sheet, a plurality of high-thermal conductivity wires fixed on the heat exchange sheet and a heat exchange block connected with theheat exchange sheet; the heat exchange unit is used for exchanging heat with the integrated circuit board; and the cooling unit is provided with a heat dissipation block, a radiator, a circulation pump and a cooling liquid which are connected in series with one another through a pipeline so as to form a loop; the heat exchange sheet and the heat exchange block are a heat exchange layer and a heatexchange block respectively which are made of a phase-change heat storage material; the heat dissipation block and the heat exchange block are attached to each other so as to be used for taking away heat in the heat exchange unit.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device for an integrated circuit board and the integrated circuit board. Background technique [0002] The integrated circuit board has a certain loss during operation, and most of the loss becomes heat. When the temperature reaches or exceeds the allowable junction temperature, the components will be damaged. Therefore, it is necessary to install a heat sink to protect the integrated circuit board. Equipment in large computer rooms and equipment with strict temperature settings will generate a lot of heat during operation, and more efficient heat dissipation devices are needed to cool down to avoid unnecessary losses. [0003] At present, the most commonly used heat dissipation method is to use a radiator to dissipate heat to the surrounding space, and if necessary, add a cooling fan to enhance cooling and heat dissipation. Commonly used radiators are aluminum allo...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the equipment in the above-mentioned large-scale computer room and the equipment with relatively strict temperature setting cannot quickly and effectively dissipate heat during operation, and the purpose is to provide a cooling device for integrated circuit board and its

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