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Thin film packaging structure and organic electroluminescent device

A thin-film encapsulation, organic technology, applied in circuits, electrical components, electrical solid-state devices, etc., can solve the problems of poor encapsulation effect of thin-film encapsulation materials, and achieve the effect of low density, many functional groups, and large specific surface area.

Active Publication Date: 2018-07-06
KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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  • Abstract
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  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to provide a thin-film packaging structure and an organic electroluminescent device to solve the problem of poor packaging effect of existing thin-film packaging materials

Method used

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  • Thin film packaging structure and organic electroluminescent device
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Embodiment Construction

[0025] As mentioned in the background art, the encapsulation effect of the traditional thin film encapsulation structure is not ideal. The inventor found that this is because the organic encapsulation material of the organic encapsulation layer 300 and the inorganic encapsulation materials of the first inorganic encapsulation layer 200 and the second inorganic encapsulation layer 400 belong to two different materials, mainly on the microscopic or atomic scale. The mechanical combination of the two, the interface does not match, and the adhesion between the two is low, which is prone to film peeling, increases the probability of water and oxygen intrusion, and affects the packaging effect.

[0026] The inventors have found that using organic-inorganic nanocomposites as an alternative material for the organic encapsulation layer can improve the above problems. Specifically, inorganic nanoparticles (SiN X or SiO X Nanoparticles) dispersed in the composite matrix (polydimethylsil...

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Abstract

The invention provides a thin film packaging structure and an organic electroluminescent device. The thin film packaging structure comprises one or more layers of inorganic packaging layer and an organic / inorganic microsphere layer covering the inorganic packaging layer, or covered by the inorganic packaging layer, or between the inorganic packing layers; the material of the organic / inorganic microsphere layer is a high-molecular composite material. The organic / inorganic microsphere layer comprises a composite matrix and a hollow nano microsphere dispersed in the composite matrix. In the thinfilm packaging material and the organic electroluminescent device provided by the invention, organic / inorganic microsphere layer is adopted for replacing organic sealing material. The adhesive force of the inorganic microsphere layer and the inorganic packaging layer is increased and the packaging effect is improved. In addition, the uniformity of the hollow nano-spheres in the inorganic microsphere layer can improve the color deviation of the film packaging structure.

Description

technical field [0001] The invention relates to the field of optoelectronic technology, in particular to a thin film packaging structure and an organic electroluminescent device. Background technique [0002] At present, thin film packaging technology generally uses Barix packaging technology, that is, organic-inorganic alternating multilayer film structure, such as figure 1 As shown, it includes a first inorganic encapsulation layer 200 covering the OLED unit 100 , an organic encapsulation layer 300 covering the first inorganic encapsulation layer 200 , and a second inorganic encapsulation layer 400 covering the organic encapsulation layer 300 . Among them, the inorganic materials of the first inorganic encapsulation layer 200 and the second inorganic encapsulation layer 400 play a real barrier role, as a barrier layer and a barrier for the diffusion of water and oxygen, and the commonly used material is SiN X and SiO X , and the organic material of the organic encapsulat...

Claims

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Application Information

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IPC IPC(8): H01L51/52
CPCH10K50/8445H10K50/844
Inventor 潘露露黄秀颀朱晖叶訢胡小叙
Owner KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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