Automatic mounting and tin block addition-based through hole reflow soldering

Abstract

The invention relates to the design field of a circuit, and particularly relates to an automatic mounting and tin block addition-based through hole reflow soldering. By applying automatic mounting andtin block addition-based through hole reflow soldering, a tin block material is loaded by a braided band, so that automatic material taking and tin block mounting and adding are realized; and the problems of less tin and poor soldering caused by the generated tin balls in the through hole reflow soldering are solved, reliability of through hole reflow soldering is improved, the processing qualityof a PCBA board is improved, the repair cost in manpower tin-supplementing soldering is lowered, and the hidden risk of short circuit caused by tin ball residue is eliminated.

Description

technical field [0001] The invention relates to the field of circuit design, in particular to a through-hole reflow soldering method based on automatic patch adding of tin blocks. Background technique [0002] At present, through-hole reflow soldering is widely used, but in the application process, it is found that through-hole reflow soldering is very prone to soldering defects such as less tin, virtual soldering, and insufficient soldering. The traditional method increases the opening of the stencil to increase the amount of tin or thicken the stencil (ladder stencil) to increase the amount of tin. Now dense PCBA boards require that the thickness of the stencil should not be too thick (resulting in too thick solder paste for edge devices, resulting in continuous Tin is bad), and the opening of the stencil is increased to increase the amount of tin, a large number of tin beads are easily produced during the welding process, and it is easy to cause the risk of short circuit ...

AI Technical Summary

Problems solved by technology

[0004] as attached Figure II : Picture of poor tin connection of chip devices and bad picture of solder beads on the surface of the soldering board. From the picture, it can be seen that the method of thickening the steel mesh (ladder steel mesh) to solve the problem of less tin in through-hole reflow soldering will cause edge device chips Poor tin connection occurs; the method of expanding the stencil to solve the problem of soldering less tin in through-hole reflow soldering will cause tin beads on the board surface, which may cause a short circuit risk of the board

[0005] as attached Figure three : Rework pictures of employees repairing PCBA with poor soldering. It can be seen from the picture that it is very time-consuming and difficult for employees to repair PCBA boards.

[0006] Therefore, the present invention designs a through-hole reflow soldering that automatically adds tin blocks to the patch, and solves poor soldering such as less tin, virtual soldering, and insufficient soldering in reflow soldering.

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