An integrated assembly system and assembly method for microwave device components

Abstract

The invention discloses an integrated assembling system and method for a microwave device module. The assembling system comprise an integrated assembling device, a fully-automatic transporting and moving system, a fully-automatic feeding system, multiple assembling production units, a fully-automatic discharging system and a data storage and processing system, wherein the fully-automatic feeding system, the multiple assembling production units and the fully-automatic discharging system are communicated through the fully-automatic transporting and moving system; the integrated assembling deviceperforms circulating transfer among the fully-automatic feeding system, the multiple assembling production units and the fully-automatic discharging system by the aid of the fully-automatic transporting and moving system; the data storage and processing system is simultaneously connected with the fully-automatic transporting and moving system, the fully-automatic feeding system and the multiple assembling production units and is used for implementing data interaction with all the systems, reading, distributing and storing read information and issuing instructions to other systems.

Description

technical field [0001] The invention relates to the technical field of radar microwave devices, in particular to an integrated assembly system for microwave device components and an assembly method thereof. Background technique [0002] With the development of radar electronics towards array and miniaturization. The application of microwave device components (Multichip Module) has become more and more extensive, and the demand for tens of thousands or even larger scales has begun to appear. How to quickly mass-assemble components has become an urgent problem to be solved. The arraying of radar puts forward more quantitative requirements for microwave device components, and within a limited time, more components with better consistency and higher yield can be assembled. Faced with such a situation, the current assembly site often affects the assembly efficiency of component assembly equipment due to the slow clamping speed of components, or the semi-finished components are ...

AI Technical Summary

Problems solved by technology

Faced with such a situation, the current assembly site often affects the assembly efficiency of component assembly equipment due to the slow clamping speed of components, or the semi-finished components are scrapped due to accidentally breaking component leads and other connecting devices when manually clamping components; in addition, small batches During the assembly process of the components, it is possible to manually view the component numbers in sequence and record the device information used to assemble the components. However, when faced with mass assembly of components, it is difficult for manual records to follow the rapid assembly speed and circulation speed of the components, and it is very easy in the assembly process. The phenomenon that the information is wrong and difficult to trace due to personnel fatigue during the recording process

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