Method for polishing SIC optical freedom curve by Fenton-assisted rigidity-variable pneumatic grinding wheel

A pneumatic grinding wheel and variable stiffness technology, which is applied in the direction of optical surface grinders, grinding/polishing equipment, grinding machines, etc., can solve the problems of low precision and efficiency, and achieve great economic and social benefits, good sealing, and low manufacturing costs low effect

Inactive Publication Date: 2018-08-07
ZHEJIANG UNIV OF TECH
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Problems solved by technology

[0006] In order to overcome the existing problems of low precision and efficiency in the polishing technology for free-form surface SIC workpieces, and the problem that the Fenton reaction polishing device can only process flat SIC workpieces, the present invention proposes a high-efficiency, low-cost The method of polishing SIC optical free-form surface with Fenton-assisted variable stiffness pneumatic grinding wheel

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  • Method for polishing SIC optical freedom curve by Fenton-assisted rigidity-variable pneumatic grinding wheel
  • Method for polishing SIC optical freedom curve by Fenton-assisted rigidity-variable pneumatic grinding wheel
  • Method for polishing SIC optical freedom curve by Fenton-assisted rigidity-variable pneumatic grinding wheel

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Embodiment Construction

[0032] The present invention will be further described below in conjunction with the accompanying drawings.

[0033] refer to Figure 1 ~ Figure 4 , a Fenton-assisted variable stiffness pneumatic grinding wheel polishing SIC optical free-form surface method, firstly, the catalyst and the oxidant are poured into the reaction pool 14 according to a certain concentration and ratio to react to generate strong oxidant hydroxyl radicals, and then the insulating material 16 is placed The SIC workpiece 11 is completely submerged in the reaction pool 14 containing the Fenton reagent 15, allowing the exposed SIC optical free-form surface to be processed to react with the Fenton reagent to form a SIO with a hardness smaller than that of the SIC and a uniform thickness. 2 surface layer. After the reaction is complete, the SIC workpiece 11 is taken out, and fixed on the workbench 13 with a limiting device. The limiting device may be: a negative pressure suction cup, a positioning fixture, a...

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Abstract

The invention relates to a method for polishing an SIC optical freedom curve by a Fenton-assisted rigidity-variable pneumatic grinding wheel. The method comprises the following steps of firstly, sheathing the non-processing surface of an SIC workpiece with an isolation material; then, completely submerging into a reaction cell with a Fenton reagent, reacting for a period of time, uniformly forminga SiO2 surface layer with equal thickness at the surface of the SIC workpiece, fetching out the SIC workpiece, and fixing the SIC workpiece onto a worktable by a limiting device; uniformly removing the generated SiO2 surface layer after reaction by a floating connecting device; adjusting the location and gesture of a tool system corresponding to the workpiece by a mechanical arm, changing the airpressure of compressed air entering the rigidity-variable pneumatic grinding wheel to adjust the rigidity of the rigidity-variable pneumatic grinding wheel, attaching the rigidity-variable pneumaticgrinding wheel and the SIC workpiece with freedom curve, and finally polishing the SIC workpiece with the freedom curve by the rigidity-variable pneumatic grinding wheel. The method for polishing theSIC optical freedom curve by the Fenton-assisted rigidity-variable pneumatic grinding wheel has the advantages that the efficiency is high, and the cost is low.

Description

technical field [0001] The invention belongs to the technical field of surface finish processing of workpieces, and proposes a method for polishing SIC optical free-form surfaces with Fenton-assisted variable stiffness pneumatic grinding wheels. Background technique [0002] SIC materials have the advantages of good thermal conductivity, high breakdown field strength, small dielectric constant, large forbidden band width, etc., and because of their excellent properties such as radiation resistance and wear resistance, they are widely used in the semiconductor material market. The application is getting wider and wider. In the rapid development, semiconductor materials are more and more used in aerospace, military, electronics and other important aspects. With the increase of its application range, planar SIC materials have gradually failed to meet people's needs, and curved SIC materials are also increasingly required, which has a good development prospect and future. [00...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B13/00B24B13/005B24B13/01B24B41/00B24B41/02C04B41/87
CPCB24B13/00B24B13/005B24B13/012B24B41/007B24B41/02C04B41/5035C04B41/87C04B41/459C04B41/4556
Inventor 赵军江恩勇计时鸣
Owner ZHEJIANG UNIV OF TECH
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