Orthopedic implant device with copper-containing coating and method of making the same

A copper-coated, orthopedic technology, applied in the field of copper-coated orthopedic implant devices, can solve problems such as lack of biological activity, shorten the healing period, avoid bacterial resistance, and increase the success rate of use.

Active Publication Date: 2021-03-02
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Most of the orthopedic implants currently in clinical use are inert materials, that is, they do not have biological activity (promoting osteogenesis, promoting vascularization, etc.)

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Orthopedic implant device with copper-containing coating and method of making the same
  • Orthopedic implant device with copper-containing coating and method of making the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Preparation of coatings with gradient copper-loaded particles on orthopedic implants by layer-by-layer chemical grafting:

[0042] Copper-loaded microspheres with active functional groups such as hydroxyl and carboxyl groups were immobilized on natural degradable chitosan polymers with amino and hydroxyl groups by layer-by-layer chemical grafting, and the amount of copper loaded in each layer was gradient. Copper ions are released through layer gradient, and the biofunctionalization of copper-containing coatings can be adjusted.

[0043] (1) Preparation of copper-loaded microspheres

[0044] ① Weigh 0.05g, 0.2g and 0.5g CuCl 2 , and were dissolved in 5mL distilled water to prepare three homogeneous solutions;

[0045] ② Dissolve 1.0 g of PACA in a mixed solution of chloroform and acetone (wherein the volume ratio of chloroform: acetone is 3:2), and prepare a PACA organic solution with a mass volume concentration of 100 mg / mL;

[0046]③Weigh 1.0g of PVA, dissolve it i...

Embodiment 2

[0062] Coatings with gradient copper-loaded microspheres prepared on orthopedic implants by layer-by-layer electrostatic adsorption method:

[0063] (1) Prepare an aqueous solution of negatively charged sodium hyaluronate (concentration 1-5%), and prepare a hyaluronic acid coating on the bioglass block bone filler by extraction;

[0064] (2) Preparation of copper-loaded microspheres

[0065] ①Weigh 0.20g of chitosan into a 250mL single-necked round bottom flask, add 250mL of 2% (mass fraction) acetic acid solution, turn on the electric stirring device and stir slowly until the chitosan is completely dissolved.

[0066] ② Add Span-80 0.4mL and Tween-80 0.6mL while stirring, and continue stirring for 30min to form a uniform, transparent and stable microemulsion. Then add 0.05g copper sulfate powder, stir at high speed to make it spread evenly;

[0067] ③Slowly add 1mol·L dropwise -1 NaOH solution, while stirring at a constant speed, use the PHS-3B precision pH meter (Shanghai...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
thicknessaaaaaaaaaa
sizeaaaaaaaaaa
Login to view more

Abstract

The invention discloses an orthopedic implanted device provided with a copper-bearing coating. Copper-bearing microspheres, which are different in concentration, are immobilized / dispersed into a polymer carrier on the surface of the orthopedic implanted device in a certain mode by a gradient, so that bio-functionalization of the orthopedic implanted device is achieved, wherein the functional copper-bearing microspheres can be immobilized in such modes as chemical grafting, physical blending, electrostatic interaction and the like. The orthopedic implanted device provided with the bio-functional copper-bearing coating, as being implanted into a body, can promote bone tissue healing, promote angiogenesis and inhibit bacterial infection, so that a problem on infection caused by implantation of the orthopedic implanted device can be avoided and the healing of damaged bone tissues can be accelerated.

Description

technical field [0001] The invention relates to the field of orthopedic implant medical devices, and in particular provides a copper-coated orthopedic implant device capable of fixing fractures or filling bone defects and having biological functions such as anti-infection, promoting osteogenesis, and promoting vascularization. Background technique [0002] Orthopedic implant devices are devices (materials) used to fix fracture sites, fill bone defect cavities or gaps between bone implant devices and the bone bed. Its role is to accelerate the healing of bone defects or to fix bone implants. With the continuous development of population aging and the accelerated pace of life / work, the proportion of fractures, trauma, bone tumors, and joint diseases worldwide is increasing year by year, and the number of bone infections caused by this has surged. Although a large number of antibiotics have been used to treat bone infection, with the increase of drug-resistant bacteria, the tr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): A61L27/34A61L27/30A61L27/54
CPCA61L27/306A61L27/34A61L27/54A61L2300/404A61L2300/412A61L2300/622A61L2420/04A61L2430/02
Inventor 陈姗姗杨柯张炳春杨辉
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap