An alignment and bonding device used in the manufacture of mems devices
A technology for bonding devices and devices, which is applied to microstructure devices, processing microstructure devices, instruments, etc., to achieve the effects of simple operation, improved positioning accuracy, and strong scalability
Active Publication Date: 2020-06-16
DALIAN UNIV OF TECH
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Problems solved by technology
[0003] MEMS devices usually have 3D microstructures, such as microfluidic chips, and traditional processing methods are difficult to realize the processing of 3D microstructures, so researchers proposed a method of bonding two chips with microstructures on the upper and lower sides to Fabricate 3D microstructures
The alignment and bonding device generally uses a CCD camera and a precision adjustment platform to achieve precise bonding of two-layer chips. However, the microstructure on the chip is usually between a few microns and tens of microns. Even with the help of a microscope, manual adjustments will produce large error
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[0038] The present invention will be further described in detail below in conjunction with the accompanying drawings and technical solutions.
[0039] Such as Figure 1-3 As shown, an alignment and bonding device for MEMS device manufacturing includes a base 1, a main two-dimensional mobile platform 2, a support frame 3, a secondary three-dimensional mobile platform 4, a leveling assembly 5, a rotating assembly 6 and a CCD The observation component 7 is provided with a bracket on the base 1, and the CCD observation component 7 can be installed on the bracket detachably. The main two-dimensional mobile platform 2 is a screw screw platform fixed on the base 1, and the two-dimensional mobile platform 2 is provided with a support frame 3. The supporting frame 3 can realize the movement of the XY axis, and realize the precise positioning of the chip and the CCD observation component 7 .
[0040] Such as Figure 4-5 As shown, the upper end of support frame 3 is provided with slot,...
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The invention belongs to the technical field of alignment bonding, and relates to an alignment bonding device applied to manufacturing an MEMS device. The device comprises a pedestal, a main two-dimensional moving platform, a support frame, an auxiliary three-dimensional moving platform, a leveling component, a rotation component and a CCD observation device, wherein a support is arranged on the pedestal, and the CCD observation device is detachably installed on the support; the main two-dimensional moving platform is fixed on the pedestal, and the support frame is fixed on the main two-dimensional moving platform; the auxiliary three-dimensional moving platform is fixed on the support frame, an XY-axis moving platform is an electromagnetic moving platform, and a Z-axis moving platform isa spiral lead screw platform; the leveling component performs spherical surface contact type leveling, and is fixed on the Z-axis moving platform; and the rotation component is used for performing spherical surface contact type leveling, and positioned above the leveling component, and an incomplete sphere at the bottom is in touch with the leveling component. The alignment bonding device providedby the invention integrates alignment, leveling and bonding functions, and solves the problem that the error is relatively large when the chip is manually aligned.
Description
technical field [0001] The invention belongs to the technical field of alignment bonding, and relates to an alignment bonding device used for manufacturing MEMS devices. Background technique [0002] The full English name of MEMS is: Micro-Electro-Mechanical Systems, generally also known as micro-electro-mechanical systems. Micro-electro-mechanical systems refer to high-tech devices with a size of a few millimeters or less. An independent intelligent system is a micro-device or system that integrates micro-sensors, micro-actuators, micro-mechanical structures, micro-power sources, signal processing and control circuits, high-performance electronic integrated devices, interfaces, and communications. MEMS technology is the broadening and extension of microelectronics technology. It integrates microelectronics technology and precision machining technology. It is a revolutionary new technology widely used in high-tech industries. It is a key technology related to the country's ...
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IPC IPC(8): B81C3/00
CPCB81C3/001B81C3/004
Inventor 邹赫麟豆姣伊茂聪王上飞陈达
Owner DALIAN UNIV OF TECH