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Graphene paste applied to heat dissipation structures of electronic devices

A technology of heat dissipation structure and electronic device, which is applied in the direction of heat exchange materials, cooling/ventilation/heating transformation, modification by conduction heat transfer, etc. Effect

Inactive Publication Date: 2018-08-17
安徽碳华新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the narrow internal space of electronic devices will also make it difficult for designers to design heat dissipation structures.

Method used

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  • Graphene paste applied to heat dissipation structures of electronic devices
  • Graphene paste applied to heat dissipation structures of electronic devices

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The graphene slurry applied to the heat dissipation structure of electronic devices is prepared as follows:

[0029] (1) After mixing and stirring 10 parts of graphene powder, 58 parts of N-methylpyrrolidone, 12 parts of 2,4-toluene diisocyanate, 3 parts of polystyrene, and 8 parts of epoxy resin by weight, the water bath is heated to React at 90°C for 8 hours to obtain modified graphene;

[0030] (2) Take by weight 46 parts of aluminum nitride, 18 parts of modified graphene, 16 parts of tetrahydrofuran, 4 parts of ceramic powder, 8 parts of ethyl propionate, 6 parts of 2-ethylhexyl acrylate, 12 parts of acrylic resin and 85 parts of water are used as raw materials;

[0031] (3) Add the raw materials into the dispersion kettle, and obtain the graphene slurry after fully stirring.

Embodiment 2

[0033] The graphene slurry applied to the heat dissipation structure of electronic devices is prepared as follows:

[0034] (1) After mixing and stirring 15 parts of graphene powder, 50 parts of N-methylpyrrolidone, 16 parts of 2,4-toluene diisocyanate, 4 parts of polystyrene, and 12 parts of epoxy resin by weight, the water bath is heated to React at 80°C for 8 hours to obtain modified graphene;

[0035] (2) Take by weight 58 parts of aluminum nitride, 25 parts of modified graphene, 20 parts of tetrahydrofuran, 8 parts of ceramic powder, 15 parts of ethyl propionate, 10 parts of 2-ethylhexyl acrylate, 16 parts of acrylic resin and 100 parts of water are used as raw materials;

[0036] (3) Add the raw materials into the dispersion kettle, and obtain the graphene slurry after fully stirring.

[0037] As shown in the figure, the heat dissipation structure of the electronic device using the above-mentioned graphene paste includes a substrate 1, and the upper surface of the subs...

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Abstract

The invention provides graphene paste applied to heat dissipation structures of electronic devices. The graphene paste is prepared from, by weight, 42-58 parts of aluminum nitride, 8-30 parts of modified graphene, 15-22 parts of tetrahydrofuran, 3-8 parts of ceramic powder, 5-15 parts of ethyl propionate, 4-10 parts of 2-ethylhexyl acrylate, 8-16 parts of acrylic resin and 70-100 parts of water. The graphene paste has advantages of quickness in cooling, high efficiency and energy efficiency saving.

Description

technical field [0001] The invention relates to a graphene slurry, in particular to a graphene slurry applied to a heat dissipation structure of an electronic device. Background technique [0002] Power adapters and power supplies are indispensable electronic devices for the operation of various electrical equipment. These electronic devices have many electronic components on their internal circuit boards, and these electronic components include not only high heating power components (such as transformers, metal oxide semiconductor field effect transistors, diodes, inductors, etc.) but also low heating power components (such as capacitor or resistor). When the electronic device is in operation, if the heat generated by these electronic components cannot be effectively removed from the outside, the heat will be accumulated in the electronic device and the temperature of these electronic components will rise. If the temperature of these electronic components is too high, the...

Claims

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Application Information

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IPC IPC(8): C09K5/08H05K7/20
CPCC09K5/08H05K7/2039
Inventor 陈玲杨源
Owner 安徽碳华新材料科技有限公司