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A method and device for detecting the three-dimensional surface topography of the entire circumference of a diamond wire saw

A diamond wire saw, three-dimensional surface technology, used in measuring devices, optical devices, instruments, etc.

Active Publication Date: 2020-05-05
HUAQIAO UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] In fact, there is no existing technology that can realize the measurement of the entire circumference of the diamond wire saw

Method used

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  • A method and device for detecting the three-dimensional surface topography of the entire circumference of a diamond wire saw
  • A method and device for detecting the three-dimensional surface topography of the entire circumference of a diamond wire saw
  • A method and device for detecting the three-dimensional surface topography of the entire circumference of a diamond wire saw

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Embodiment Construction

[0084] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0085] In order to solve the problem in the prior art that the height information of the abrasive particles cannot be directly measured, or the complete three-dimensional information of the abrasive particles cannot be given, the present invention provides a method for detecting the three-dimensional surface topography of the entire circumference of a diamond wire saw, and a diamond wire saw. The three-dimensional surface topography detection device for the entire circumference of the wire saw can achieve a single measurement without splicing to obtain the three-dimensional information of the entire circumference of the diamond wire saw, including the complete three-dimensional information of the abrasive grains.

[0086] Such as figure 1 , figure 2 As shown, the device for detecting the three-dimensional surface topography of the entire cir...

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Abstract

The invention relates to a method and device for detecting the complete-circle three-dimensional surface morphology of a diamond fretsaw, and the method and device can obtain the complete-circle surface morphology of the diamond fretsaw through a single measurement operation without splicing. An image data processing method is relatively simple, and the obtained surface information of the diamondfretsaw is complete. A sequence projection contour image is used for reconstructing a diamond three-dimensional morphology, thereby solving a problem that the quality of the collected image data is liable to be affected by the light reflection intensity of the surface of an object. The generated redundant data can be used for quickly achieving the analysis of two-dimensional images (including depth) of different positions of the surface of the diamond fretsaw, meets the actual requirements of the diamond fretsaw for the quick detection, and also can be efficiently used. The device has the functions of quickly obtaining the two-dimensional and complete-circle three-dimensional surface morphology of the diamond fretsaw and performing composite detection, and can meet the different detectionrequirements. Through the cooperation of a laser source and a second camera, the method and device enable the diamond fretsaw images to be convenient to process, and improve the measurement precision.Moreover, the structure is simple and the idea is ingenious.

Description

technical field [0001] The invention relates to a shape detection technology, and more specifically, to a method for detecting the three-dimensional surface topography of the entire circumference of a diamond wire saw, and a device for detecting the three-dimensional surface topography of the entire circumference of a diamond wire saw. Background technique [0002] Diamond wire saws use electroplating or resin bonding methods to fix diamond abrasives on wires, and are mainly used for cutting hard and brittle materials, such as sapphire and silicon. For different materials, the specifications of the diamond wire saw used are also different. The diameter of the diamond wire saw used for cutting sapphire is 0.2 mm to 0.3 mm. [0003] The density, size and uniformity of the diamond abrasive grains on the diamond wire saw will directly affect the cutting efficiency, incision size, surface quality of the slice, and life of the diamond wire saw. Therefore, a detection device is req...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B11/24
CPCG01B11/24G01B11/2433
Inventor 崔长彩李振宇黄辉黄国钦徐西鹏
Owner HUAQIAO UNIVERSITY
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