Semi-inclusion direct surface-mounting ground stress relief test device and method

Abstract

The invention provides a semi-inclusion direct surface-mounting ground stress relief test device and method. According to the device and method, measuring errors of stress-strain transmission, broughtby an inclusion layer and an adhesive layer of a hollow inclusion type strain gauge are eliminated, and a waterproof protection function of strain foils and lines by the strain gauge is reserved. Thedevice comprises a support, a support member connected with the support, and a rubber cylinder arranged at the periphery of the support member in a sleeved manner, the support member is formed by splicing of at least 3 arc blocks, each arc block is provided with a groove hole for installing a strain bundle push block from an inner bore to an exterior, the exterior of the strain bundle push blockis an arc structure, the plurality of arc blocks and the strain bundle push blocks are spliced to form a cylinder structure, and the rubber cylinder is arranged on an outer wall of the cylinder structure formed by the support member and the strain bundle push blocks in a sleeved manner. An outer end wall of each strain bundle push block is provided with a non-deformation layer, the rubber cylinderis provided with an opening for installing a strain bundle, and the non-deformation layer and the opening of the rubber cylinder are bonded; and a compensating gauge or a temperature sensor is bondedto the non-deformation layer, and strain bundle rubber and the strain bundle are bonded thereon in sequence.

Description

technical field [0001] The invention relates to the technical field of stress measurement for three-dimensional hole wall strain relief, in particular to a stress relief testing device and method for semi-included direct patching. Background technique [0002] The hole wall strain relief method is currently one of the most widely used methods for in-situ stress measurement in large-scale underground projects in industries such as water conservancy, hydropower, transportation, nuclear power, and mining. This method is the only measurement method that can give a three-dimensional stress state in a single test. So far, the hole wall strain testing techniques that have appeared include direct patch, hollow inclusion, rigid inclusion and solid inclusion. The direct mount technology has appeared successively since the 1960s, represented by the successful development of the "CSIR triaxial hole wall strain gauge" in South Africa. This method is one of the in-situ stress test method...

AI Technical Summary

Problems solved by technology

However, it has the following limitations: Compared with the direct patch technology, the hollow inclusion test increases the stress-strain transfer link of the glue layer and the epoxy resin layer, and adds 4 calculation parameters to obtain the analytical results

Therefore, this technology increases the testing process and reduces the measurement accuracy, which makes the test results have certain uncertainties.

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