Unlock instant, AI-driven research and patent intelligence for your innovation.

A silicon wafer cleaning equipment

A technology for silicon wafer cleaning and equipment, which is used in the manufacture of electrical components, circuits, semiconductor/solid-state devices, etc. It can solve the problems of insufficient contact between silicon wafers and cleaning solution, waste, and high cleaning solution temperature, and reduce the process of detecting cracks. , the effect of reducing workload and reducing movement speed

Active Publication Date: 2020-04-28
宁波隆锐机械制造有限公司
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention intends to provide a silicon wafer cleaning equipment to solve the problems of insufficient contact between the silicon wafer and the cleaning liquid and the high temperature of the cleaning liquid resulting in waste caused by evaporation and decomposition

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A silicon wafer cleaning equipment
  • A silicon wafer cleaning equipment
  • A silicon wafer cleaning equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] The following is a further detailed description through specific embodiments.

[0031] Cleaning cylinder 1, piston rod 2, rack 3, sector tooth plate 4, mounting plate 5, turntable 6, guide handle 7, guide hole 8, guide post 9, conduit 10, nozzle 11, silicon wafer 12, piston plate 13, Cleaning plate 14 , through hole 15 , infrared heating tube 16 , support bar 17 , waterproof cover 18 , baffle 19 , elastic cover 20 .

[0032] Wafer cleaning equipment such as figure 1 , figure 2 and image 3 Shown: including a cleaning cylinder 1, the cleaning cylinder 1 stores the cleaning liquid of the silicon wafer 12, the cleaning cylinder 1 is air-tightly fitted with a piston plate 13, and the piston plate 13 is welded to the outer side of the cleaning cylinder 1 with a piston rod 2, The piston rod 2 passes through the inner bottom of the cleaning cylinder 1 and fits with the inner bottom clearance. The end of the piston rod 2 located outside the cleaning cylinder 1 is fixed with...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the field of auxiliary devices for silicon wafer research and development, in particular to a silicon wafer cleaning device, comprising a cleaning cylinder for holding a cleaning liquid. The cleaning cylinder is air-tightly fitted with a piston plate. The piston plate is fixedly provided with a piston rod penetrating through the inside bottom of the cleaning cylinder. Thepiston rod is driven by a power mechanism to move up and down. A cleaning plate is fixedly arranged in the middle of the cleaning cylinder. A plurality of through holes are opened in the cleaning plate. An infrared heating tube is fixedly arranged in each through hole. A gap is between each infrared heating tube and the inner wall of the corresponding through hole. The outer wall of each infraredheating tube is sleeved with a heat-conducting and transparent waterproof sleeve. The cleaning cylinder is fixedly provided with nozzles. The nozzles are inclined downward toward one side of the center of the cleaning cylinder. The cleaning cylinder is provided with a plurality of conduits, which are connected at one end to the wall of the cleaning cylinder near the bottom side of the cleaning plate and are detachably connected at the other end to the nozzles. According to the invention, the silicon wafer cleaning device reduces the temperature of the cleaning liquid while ensuring sufficientcontact between a silicon wafer and the cleaning liquid, avoids the over high speed of evaporation decomposition of the cleaning liquid, and can detect whether the silicon wafer has cracks.

Description

technical field [0001] The invention relates to the field of auxiliary devices for silicon wafer research and development, in particular to a silicon wafer cleaning device. Background technique [0002] Silicon wafer is an important material for making chips. Because the chips made of silicon wafers have very good computing power, the working speed of chips made of silicon wafers is fast and the accuracy is high, so the application range of silicon wafers is very wide. For example, silicon wafers have been Applied to aerospace, medicine, agriculture, defense and industrial automation. [0003] Silicon wafers need to be sliced ​​during R&D and production. There are two main ways of slicing silicon wafers: inner circle cutting and wire cutting. It will also be polluted, resulting in low surface cleanliness. The polluted silicon wafer will have a great impact on the upcoming etching, so silicon wafer cleaning is an important operation. [0004] The existing patent CN101773917...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67051H01L21/67288
Inventor 叶敏
Owner 宁波隆锐机械制造有限公司