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A kind of preparation method of micro-angle driving device

A driving device and micro-angle technology, applied in the manufacture/assembly of piezoelectric/electrostrictive devices, piezoelectric/electrostrictive/magnetostrictive devices, electrical components, etc., can solve the problem of improving driving efficiency and displacement range, etc. problem, achieve the effect of reducing deformation and stress, improving device reliability and avoiding cracks

Active Publication Date: 2020-10-02
浙江宝纺印染有限公司
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  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to provide a preparation method of a micro-angle driving device in order to solve the above problems, to solve the problem of using a rectangular piezoelectric device in the prior art and realizing displacement driving through the expansion and contraction of the piezoelectric device, but its driving efficiency and The problem that the displacement range needs to be improved

Method used

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  • A kind of preparation method of micro-angle driving device
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  • A kind of preparation method of micro-angle driving device

Examples

Experimental program
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Embodiment 1

[0028] Step (1), such as figure 1 As shown, a substrate 1 is provided, and an opening is formed on the substrate 1;

[0029] Step (2), such as figure 2 As shown, a pair of throwing silicon dioxide silicon wafer 2 is provided, and the double throwing silicon dioxide silicon wafer 2 is fixed above the opening;

[0030] Step (3), such as image 3 As shown, an adhesive layer, a lower electrode, a piezoelectric layer, and a Ti / Pt upper electrode are sequentially prepared on the double-polished silicon dioxide wafer, and after patterning, a piezoelectric unit 41 and a piezoelectric unit 42 with a special-shaped structure are formed. . Piezoelectric unit 43 and piezoelectric unit 44, the special-shaped structure is a strip structure with a width at both ends greater than a width in the middle;

[0031] Step (4), using the piezoelectric unit and the mask to pattern the double-thrown dioxygen silicon wafer to form a central area 6 and two sets of support arms, and the central area...

Embodiment 2

[0034] The preparation process of embodiment 2 is basically the same as embodiment 1, the difference is as Figure 6 As shown in the formation of steps (3) and (4), each group of support arms has two connecting arms, and the connecting arms are arranged in a meandering continuous structure, and the adjacent connecting arms are connected by joints 5, and the distance between the connecting arms is is 2.5 microns, and the width in the middle of the tether is 1.8 microns. The piezoelectric unit conformally arranged with the connecting arm is the piezoelectric unit 91 and the piezoelectric unit 92 on the upper support arm, and the piezoelectric unit 93 and the piezoelectric unit 94 on the lower support arm, wherein the piezoelectric unit 91 and the piezoelectric unit The electrical unit 92 is deformed in opposite directions, the piezoelectric unit 93 and the piezoelectric unit 94 are deformed in opposite directions, and at the same time, the deformation directions of the upper and...

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Abstract

The invention discloses a preparation method of a micro-angle driving device, which includes providing a substrate with an opening structure, forming a double-throwing hydrogen dioxide silicon wafer with a suspended structure, an adhesive layer, a lower electrode, a piezoelectric Layer, Ti / Pt upper electrode stack, after patterning to form a special-shaped structure. Aiming at the problem that rectangular piezoelectric devices are usually used in the prior art to realize displacement driving through the expansion and contraction of piezoelectric devices, but the driving efficiency and displacement range need to be improved, the present invention provides a preparation method of a micro-angle driving device to realize Higher driving efficiency and larger driving displacement.

Description

technical field [0001] The invention relates to the field of driving devices, in particular to a preparation method of a micro-angle driving device. Background technique [0002] Micromechanical technology has become a hot technology in the field of modern science and technology, and it is also a key technology in nanotechnology research. In order to obtain precise driving of micro-displacement, piezoelectric actuators have gradually entered people's field of vision, and have received widespread attention due to their advantages of high control precision and fast response. The basic principle of piezoelectric drive technology is based on the inverse piezoelectric effect of piezoelectric ceramic materials, which can generate rotation or linear motion by controlling its mechanical deformation. It has the advantages of simple structure, low speed and high torque. There are 3 types of this motor, ultrasonic, peristaltic and inertial. The ultrasonic type is based on the use of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L41/25H01L41/09H10N30/03H10N30/20
CPCH10N30/2045H10N30/2044H10N30/03
Inventor 郭玉华
Owner 浙江宝纺印染有限公司
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