Forming method and forming device for doubling plate structural members

A molding device and molding method technology, applied in the field of parts processing, can solve the problems that the superplastic forming/diffusion bonding process cannot be realized, the temperature difference between superplastic forming and diffusion bonding is large, and the cost is high, so as to achieve shortened processing cycle, low cost, The effect of reducing the cost of production

Active Publication Date: 2018-09-04
CHENGDU AIRCRAFT INDUSTRY GROUP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the above-mentioned problems in the prior art, provide a forming method and forming device for double-layer plate structural parts, solve the problems of high cost and long cycle of the existing form

Method used

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  • Forming method and forming device for doubling plate structural members
  • Forming method and forming device for doubling plate structural members

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Such as Figures 1 to 2 Shown, a kind of forming method of double-layer plate structure, comprises the following steps:

[0038] X1, the material board is cut into multiple pieces by the shearing machine, two pads 15 are placed on the processing platform 13, there is a distance between the two pads 15, the cut material board is placed on the pads 15, and The edge end of the material plate is fixed on the spacer 15 by the fixing fixture 7, and the middle part of the material plate covers the distance between the two spacers 15;

[0039] X2, the material plate is connected to the negative pole of the power supply through the negative electrode lead 11, the processing tool head 1 is connected to the positive pole of the power supply through the positive electrode lead 10, the processing tool head 1 is in contact with the material plate, and the processing tool head 1, the material plate and the power supply form a closed circuit;

[0040] X3. The current in the circuit ge...

Embodiment 2

[0050] Such as Figures 1 to 2 Shown, a kind of forming method of double-layer plate structure, comprises the following steps:

[0051] X1, the material board is cut into multiple pieces by the shearing machine, two pads 15 are placed on the processing platform 13, there is a distance between the two pads 15, the cut material board is placed on the pads 15, and The edge end of the material plate is fixed on the spacer 15 by the fixing fixture 7, and the middle part of the material plate covers the distance between the two spacers 15;

[0052] X2, the material plate is connected to the negative pole of the power supply through the negative electrode lead 11, the processing tool head 1 is connected to the positive pole of the power supply through the positive electrode lead 10, the processing tool head 1 is in contact with the material plate, and the processing tool head 1, the material plate and the power supply form a closed circuit;

[0053] X3. The current in the circuit ge...

Embodiment 3

[0065] Such as Figures 1 to 2 Shown, a kind of forming method of double-layer plate structure, comprises the following steps:

[0066] X1, the material board is cut into multiple pieces by the shearing machine, two pads 15 are placed on the processing platform 13, there is a distance between the two pads 15, the cut material board is placed on the pads 15, and The edge end of the material plate is fixed on the spacer 15 by the fixing fixture 7, and the middle part of the material plate covers the distance between the two spacers 15;

[0067] X2, the material plate is connected to the negative pole of the power supply through the negative electrode lead 11, the processing tool head 1 is connected to the positive pole of the power supply through the positive electrode lead 10, the processing tool head 1 is in contact with the material plate, and the processing tool head 1, the material plate and the power supply form a closed circuit;

[0068] X3. The current in the circuit ge...

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Abstract

The invention relates to a forming method and a forming device of doubling plate structural members. The forming device comprises a machining tool head, a machining platform and a plurality of metal plate materials. A fixed clamp and two cushion blocks are installed on the machining platform. Every two corresponding metal plate materials are welded into a workblank piece through argon arc welding.A workblank molding cavity is formed in each workblank piece after welding. Each workblank piece is installed on the corresponding cushion block through the fixed clamp. The machining tool head actson the workblank pieces. The machining tool head is connected with the positive pole of a power source through a positive pole wire. The workblank pieces are connected with the negative pole of the power source through negative pole wires. The workblank piece molding cavities communicate with a vacuum pump through titanium pipes. The workblank pieces are electrified so that heat can be generated,the workblank pieces are heated to the diffusion bonding temperature of the materials through a self-resistance heating mode, the machining tool head moves along a machining track under the control ofNC, no mold is needed in the molding technique of plates, the forming method is low in cost, and the period is shortened.

Description

technical field [0001] The invention belongs to the technical field of part processing, and in particular relates to a forming method and a forming device of a double-layer plate structure. Background technique [0002] For two-layer plate structural parts of superplastic materials such as titanium alloy and aluminum alloy, the combined superplastic forming / diffusion joining process is often used, and the superplastic forming / diffusion joining combination process only needs one tooling to complete superplastic forming and diffusion joining. , which has certain advantages over the traditional forming method, however, based on the forming environment of superplastic forming / diffusion bonding process, it has more stringent conditions for the mold, such as requiring good oxygen scratch resistance of the mold material, thermal stability and high temperature Mechanical properties and creep resistance, etc. [0003] The patent number is CN201769359U, and the application date is 20...

Claims

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Application Information

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IPC IPC(8): B23P15/00B23P23/04
CPCB23P15/00B23P23/04
Inventor 王宇盛姚刚张晶
Owner CHENGDU AIRCRAFT INDUSTRY GROUP
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