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Large-power island special power supply module cooling device and temperature control method thereof

A temperature control method and technology of special power supply, applied in electrical digital data processing, special data processing applications, instruments, etc., can solve problems such as equipment aging failure, harsh island environment, large temperature difference between day and night, etc. Heat dissipation efficiency, fast dissipation effect

Inactive Publication Date: 2018-09-07
HUNAN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The environment of the island is harsh, the annual average humidity is as high as 85%, the surface temperature in summer is as high as 60°C, and the temperature difference between day and night is large. High salt spray, high humidity, and high temperature difference bring great challenges to the long-term reliable operation of power supply equipment: Short-circuit fryer, high salt spray leads to corrosion of circuit boards and damage to the fryer, overheating causes rapid aging of equipment and frequent failures

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  • Large-power island special power supply module cooling device and temperature control method thereof
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  • Large-power island special power supply module cooling device and temperature control method thereof

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Embodiment Construction

[0030] The module unit of the present invention uniformly adopts the cavity formed by the air duct, the top cover of the power supply, and the side panel as the package to form a multi-face heat dissipation structure. The contact surface between the air duct and the power device is embedded with a heat soaking pipe to disperse the heat from the point heat source and reduce the diffusion thermal resistance, improving the heat dissipation efficiency. The cooling air is quickly conveyed through the cooling air channel inlet and outlet fans, so that the conducted heat can be quickly transferred to the outside of the module through cold and heat exchange, so as to achieve the purpose of overall heat dissipation of the power module. A thermal coupling model is established based on historical data and equipment characteristics. The control part of the device includes a temperature monitoring module and a main control module, which cooperate with the constructed model to realize model ...

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Abstract

The invention discloses a large-power island special power supply module cooling device and a temperature control method thereof. A specific position obtained by a temperature monitoring module is subjected to temperature analysis, a thermal model of a sealed cavity is established, particle swarm optimization is used for correcting the established model, the model can more accurately describe a machine box temperature change process, adaptivity and prediction control reliability are improved, and a master control module realizes the wind regulation of fans in different air flues and cavities on the basis of model prediction control and particle swarm optimization. The cooling structure is combined with a control strategy, the cooling structure accelerates heat to be evenly distributed andquickly scattered, cooling efficiency is obviously improved through the independent control and the mutual cooperation of each wind enhancement component, and the effective cooling of the large-powerisland special power supply under a high-temperature environment is realized.

Description

technical field [0001] The invention relates to a cooling device for a high-power sea-island special power supply module and a temperature control method thereof, which are suitable for heat dissipation treatment of the sea-island special power supply. Background technique [0002] In the field of power electronics technology, power devices and inductors and capacitors will generate heat due to their own losses. The heat will cause the temperature of the device to rise, the light one will not work normally and affect the service life, and the severe one will be damaged immediately. Therefore, corresponding heat dissipation measures will be taken for each device. Currently known heat dissipation technologies include natural convection cooling using heat sinks; forced convection cooling using heat sinks plus fan external force; flow dynamic cooling with heat pipes; liquid cooling using micro-tube cooling plates. The first two heat dissipation methods are mostly suitable for l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/20G06F2119/08
Inventor 罗安周芊帆何志兴陈燕东戴瑜兴周乐明徐千鸣
Owner HUNAN UNIV
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