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Method for deploying temperature sensors in three-dimensional network-on-chip based on greedy algorithm

A technology of temperature sensor and network-on-chip, which is applied in instrumentation, computing, special data processing applications, etc., can solve problems such as the influence of reconstruction accuracy, and achieve the effect of good practical application value.

Active Publication Date: 2018-09-14
NANJING UNIV
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Problems solved by technology

There is a problem in the application of temperature reconstruction technology, which is the measurement noise of the temperature sensor, which obviously has an important impact on the reconstruction accuracy
Therefore, it is a big challenge for designers to accurately reconstruct the temperature under noise

Method used

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  • Method for deploying temperature sensors in three-dimensional network-on-chip based on greedy algorithm
  • Method for deploying temperature sensors in three-dimensional network-on-chip based on greedy algorithm
  • Method for deploying temperature sensors in three-dimensional network-on-chip based on greedy algorithm

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Embodiment Construction

[0028] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0029] The method for deploying temperature sensors in a three-dimensional network-on-chip based on a greedy algorithm in this embodiment includes the following steps: Step 1) Establishing a thermal model of a three-dimensional network-on-chip based on a state space.

[0030] Step 2) Set the rank of the observability Gramma matrix as the optimization objective function.

[0031] Step 3) Using the greedy algorithm, select a subset S of size m from the optional location set V of the temperature sensor m , according to the subset S m Deploying temperature sensors, under the condition of satisfying the observable criterion, Kalman filter can realize the temperature reconstruction of the whole chip, and m represents the number of temperature sensors.

[0032] The thermal model of the state-space-based three-dimensional network-on-chip in step 1)...

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Abstract

The invention discloses a method for deploying temperature sensors in three-dimensional network-on-chip based on greedy algorithm. The method comprises the following steps: firstly establishing a thermal model of a three-dimensional network-on-chip based on a state space, and then setting an rank of an observability Gramian matrix as an optimal target function; selecting a subset S which is m in size from an available position set V of a temperature sensor for deploying the temperature sensor, the target function is maximized through the subset. By adopting the method, a second best solution is found in a polynomial time, a certain error interface is met. Compared with the conventional method, the method has the advantages that in the presence of measuring noise and under the condition oflimited sensor quantity, high-accuracy full-chip temperature rebuilding can be realized by combining Kalman filtering.

Description

technical field [0001] The invention relates to the field of three-dimensional on-chip networks, in particular to a method for deploying temperature sensors in a three-dimensional on-chip network based on a greedy algorithm. Background technique [0002] Network-on-chip is an effective, practical, and novel communication architecture that can meet the growing communication needs of System-on-Chip (SoC). Three-dimensional chip stacking is also an emerging technology that can effectively increase integration density and reduce chip area. As a combination of on-chip network technology and three-dimensional chip stacking technology - three-dimensional on-chip network absorbs the advantages of both, so the network transmission delay is lower, the network bandwidth is higher, and the power consumption of data exchange is lower. However, multi-chip stacking also leads to higher power consumption density and longer heat dissipation paths, so the heat dissipation problem of 3D on-ch...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/20
Inventor 李丽傅玉祥丰帆何书专潘红兵李伟
Owner NANJING UNIV
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