PCB inner line graph transfer process

Abstract

The invention discloses a PCB inner line graph transfer process comprising the following steps: the ink coating step: the semi-dry all-resin ink is coated on the surface of a PCB copper-clad plate soas to form a wet film; the pre-baking step: the wet film is baked to the semi-dry state under the temperature of 40-70 DEG C so as to obtain the semi-cured wet film; the film processing step: a layerof film protectant or release agent is coated on the film; and the exposure step: the film is attached to the surface of the semi-cured wet film to perform exposure processing so that the image on thesurface of the film is enabled to be transferred to the semi-cured wet film. According to the PCB inner line graph transfer process, the working efficiency is high, the product preparation period canbe shortened, the manufacturing process capacity can be enhanced, the line of minimum linewidth / line space=1 / 1mil can be analyzed and manufactured by the process, the precise line manufacturing capacity of the PCB (printed circuit board) can be enhanced, production of the high-precision interconnection HDI product at the highest level in the world can be met, and energy conservation, emission reduction and consumption reduction can be realized and thus the process is more environment-friendly.

Description

technical field [0001] The invention relates to a PCB inner layer circuit pattern transfer process. Background technique [0002] At present, in the pattern transfer process of PCB (Printed Circuit Board, circuit board) inner layer circuit production, the industry uses photosensitive wet film or photosensitive dry film for pattern transfer, because both methods have the following defects: [0003] 1. When the photosensitive wet film method is rolled or printed, it needs to be baked at 110°C for about 10 minutes. It is easy to stick to film (film), and the photosensitive wet film process wastes a lot of electricity and time, and the discharge of solvents will cause certain environmental pollution and protection, which is not environmentally friendly. [0004] 2. The dry film of the photosensitive dry film method is not easy to achieve a small film thickness. Since the dry film itself has a layer of PE film, and a protective film of the film itself is added during exposure, t...

AI Technical Summary

Problems solved by technology

[0003] 1. When the photosensitive wet film method is rolled or printed, it needs to be baked at 110°C for about 10 minutes. It is easy to stick to film (film), and the photosensitive wet film process wastes a lot of electricity and time, and the discharge of solvents will cause certain environmental pollution protection, which is not environmentally friendly

[0004] 2. The dry film of the photosensitive dry film method is not easy to achieve a small film thickness. Since the dry film itself has a layer of PE film, and a protective film of the film itself is added during exposure, the resolution is not high and the cost is high; The highest level in the industry is 2 / 2mil, which cannot meet the demand for high-precision interconnection HDI (High Density Interconnector, high-density interconnection) products

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