CPU radiator

Abstract

The invention discloses a CPU radiator. The CPU radiator comprises a cover plate and a main body. The top end of the main body is opened. The cover plate is installed at an opening of the top end of the main body. The cover plate is adhered to the main body and sealed. Separating walls are installed in the main body. A water channel is formed between the separating walls. The water channel is divided into multiple circles, and the water channel is annular. One end of the water channel is positioned at the center of the main body, and the other end is positioned at the side face of the main body. Two ends of the water channel are a water inlet and a water outlet respectively. The CPU radiator is capable of radiating by using water with a larger specific heat capacity, and an annular radiating waterway can contact with a heat source better, thereby reducing a flow resistance, and avoiding a local high-temperature phenomenon.

Description

technical field [0001] The invention relates to the technical field of cooling equipment, in particular to a CPU radiator. Background technique [0002] With the continuous improvement of computing performance, the energy consumption and heat generated by the central processing unit (CPU) chip are also increasing, and the heat dissipation of the chip has become the most concerned issue in the large-scale or supercomputer industry today. Conventional air-cooled heat dissipation technology is relatively mature, but the sharp increase in fan energy consumption and noise problems caused by high heat flux chip air-cooled heat dissipation have seriously hindered the improvement of computer performance. [0003] At present, many radiators adopt an in-and-out structure in which fluid enters from one end of the radiator and flows out from the other end, resulting in better heat dissipation near the inlet of the cooling fluid, and poor heat dissipation at the outlet. The overall perfo...

AI Technical Summary

Problems solved by technology

Conventional air-cooled heat dissipation technology is relatively mature, but the sharp increase in fan energy consumption and noise problems caused by high heat flux chip air-cooled heat dissipation have seriously hindered the improvement of computer performance.

[0003] At present, many radiators adopt an in-and-out structure in which fluid enters from one end of the radiator and flows out from the other end, resulting in better heat dissipation near the inlet of the cooling fluid, and poor heat dissipation at the outlet. The overall performance is poor convective heat transfer capacity and large flow resistance.

The existing radiator has poor convective heat transfer capability, and local high temperature is prone to occur, which affects the performance of the equipment

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