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A formation method for a semiconductor structure

A semiconductor and gas technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problem that the threshold voltage of transistors is difficult to meet the design requirements, and achieve the effect of increasing the threshold voltage

Active Publication Date: 2018-09-25
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the threshold voltage of the transistor formed by the prior art is difficult to meet the design requirements

Method used

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  • A formation method for a semiconductor structure
  • A formation method for a semiconductor structure
  • A formation method for a semiconductor structure

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] As mentioned in the background, the threshold voltage of the semiconductor structure formed in the prior art is difficult to meet the design requirements.

[0026] The method for forming a semiconductor structure includes: providing a substrate with a dielectric layer on the substrate, an opening in the dielectric layer, and the opening passing through the dielectric layer; forming a gate dielectric layer at the bottom of the opening; A work function layer is formed on the gate dielectric layer; after the work function layer is formed, a gate is formed in the opening.

[0027] Wherein, the semiconductor structure is an NMOS transistor, and the work function layer is titanium aluminum. The work function layer is used to reduce the threshold voltage of the formed semiconductor structure, and the precursor for forming the work function layer is a carbon-containing precursor. In the process of forming the work function layer, carbon atoms in the precursor inevitably enter ...

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Abstract

The invention provides a formation method for a semiconductor structure. The method includes the following steps: providing a substrate and forming a work function layer on the substrate. The step offorming the work function layer includes the step of forming a work function film once or multiple times. The step of forming a work function film includes the following steps: forming an initial workfunction film on the substrate, wherein the initial work function film has carbon atoms; performing de-carbon processing on the initial work function film and forming the work function film through ade-carbon precursor, wherein the de-carbon precursor is used for reacting with the carbon atoms of the initial work function film; forming grids on the work function layer. After the work function film is formed, de-carbon processing is performed on the initial work function film through the de-carbon precursor. The de-carbon precursor can be reacted with the carbon atoms of the initial work function film, so that the carbon atom content of the initial work function film is reduced, the work function of the work function layer is changed, the adjustment is performed on the threshold-voltage of a transistor, and the design requirements can be satisfied by the threshold-voltage of the transistor.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a method for forming a semiconductor structure. Background technique [0002] With the continuous progress of semiconductor technology, the integration level of semiconductor devices has been continuously improved, which requires that more transistors can be formed on a chip. [0003] Threshold voltage is an important parameter of transistors, which has a great influence on the performance of transistors. Transistors with different functions often have different requirements on threshold voltages. During the process of forming different transistors, the threshold voltages of different transistors need to be adjusted. In order to adjust the threshold voltages of different transistors, a work function layer is often formed on the surface of the gate dielectric layer of the transistor. Transistors can have different threshold voltages by selecting the thickness and mater...

Claims

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Application Information

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IPC IPC(8): H01L21/8234
CPCH01L21/823462
Inventor 邓浩徐建华
Owner SEMICON MFG INT (SHANGHAI) CORP