Water squeezing roller used for wet etching

Abstract

The invention relates to and provides a water squeezing roller. By using the water squeezing roller, the structure is simple, a silicon chip surface can be effectively protected during a production process, an EL bad proportion is reduced and production cost is saved. In the prior art, during a production process, the water squeezing roller is easy to wear, production cost is high, the silicon chip surface is easy to pollute, there are a lot of finished-product defective products and so on. By using the roller of the invention, the above technical problems are solved. The roller comprises a transmission wheel group and a support shaft which is transversely arranged above the transmission wheel group. A smooth surface extrusion sleeve sleeves the support shaft. A first gap is arranged between the middle hole of the smooth surface extrusion sleeve and the support shaft. A silicon chip is clamped between the transmission wheel group and the corresponding smooth surface extrusion sleeve. The silicon chip is moved towards an output side under the driving of the transmission wheel group.

Description

technical field [0001] The invention relates to a water squeeze roller, in particular to a water squeeze roller for wet etching which can effectively protect the surface of a silicon chip during production, reduce the proportion of EL defects and ensure the quality of the silicon chip. Background technique [0002] In the production process of solar cells, the wet etching effect determines the corrosion effect and cleaning effect of solar cells, and has a serious impact on the control of the process. When the silicon wafer is wet-etched, during the process of being transported to each tank, the silicon wafer is clamped by the upper water squeeze roller and the lower transmission mechanism to move forward, and the water squeeze roller is fixed above the transmission mechanism. On the support shaft, the main function is to introduce the solution remaining on the surface of the silicon wafer in the previous tank to the next tank, and at the same time remove impurities on the su...

AI Technical Summary

Problems solved by technology

[0003] The present invention mainly provides a water squeezing roller for wet etching with simple structure, which can effectively protect the surface of silicon wafers during the production process, reduce the proportion of EL defects, and save production costs. In the production process, the water squeezing roller is easy to wear, the production cost is high, and the surface of the silicon wafer is easy to be polluted, and there are many technical problems in the finished product.

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