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A kind of low silver content condensation type silicone conductive adhesive and preparation method thereof

A condensation-type, conductive adhesive technology, applied in the direction of conductive adhesives, adhesives, etc., can solve the problems of high cost and high price of conductive adhesive materials, and achieve the effects of reducing material costs, improving storage time, and increasing specific surface area

Active Publication Date: 2020-11-20
苏州瑞力博新材科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, common commercial conductive adhesives use silver as the conductive carrier. In order to obtain good conductivity, the amount of silver added should exceed 75wt%, or even reach 90wt%. However, silver is a precious metal and is expensive, resulting in high cost of conductive adhesive materials.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Under the condition of 25°C, weigh the proportion and weigh each component well, first add 30.5 parts of TMSS 1, 3 parts of methyl trimethoxy silicon and 65 parts of low bulk density silver powder TH05# into the planetary stirring tank, stir Simultaneously evacuate to 0.06-0.09MPa, stir at a constant speed for 1 hour, then add 0.5 part of dibutyltin diacetate under the protection of nitrogen, stir at a constant speed for 1 hour, discharge, and store in a sealed container.

[0040] After moisture curing for 7 days (25°C, 50RH%), measure the volume resistivity of the conductive adhesive (GB / T1410-2006).

Embodiment 2

[0042] Under the condition of 25°C, weigh the proportion and weigh each component. First, add 36.5 parts of TMSS 5, 5 parts of methyl tributanoximinosilane and 58 parts of low bulk density silver powder TH05# into the planetary stirring tank , stirred and evacuated to 0.06-0.09MPa at the same time, after stirring at a constant speed for 1 hour, then under the protection of nitrogen, add 0.5 parts of dibutyltin dioctoate, stir at a constant speed for 1 hour, discharge, and store in a sealed manner.

[0043] After moisture curing for 7 days (25°C, 50RH%), measure the volume resistivity of the conductive adhesive (GB / T1410-2006).

Embodiment 3

[0045] Under the condition of 25°C, weigh the proportion and weigh each component. First, add 10 42 parts of TMSS, 4.5 parts of methyltriethoxysilane and 53 parts of low bulk density silver powder TH05# into the planetary stirring tank. Stir and simultaneously evacuate to 0.06-0.09 MPa, stir at a constant speed for 1 hour, then add 0.5 parts of tetrabutyl titanate under the protection of nitrogen, stir at a constant speed for 1 hour, discharge, and seal for storage.

[0046] After moisture curing for 7 days (25°C, 50RH%), measure the volume resistivity of the conductive adhesive (GB / T1410-2006).

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Abstract

The invention discloses a conductive adhesive prepared from silver powder with low apparent density as a conductive supporter and condensed silicone as a matrix and a preparation method of the conductive adhesive. Compared with the conventional conductive adhesive technology, silver content of the conductive adhesive is reduced by 20wt%-30wt%, material cost is reduced, and the conductive adhesivefurther also has the advantages of excellent conductive performance, room-temperature curing, high weather fastness and the like; due to obvious cost advantage, the conductive adhesive has great significance in expansion of the application of the conductive adhesive.

Description

technical field [0001] The invention relates to a silicone conductive adhesive, more precisely, the invention relates to a conductive adhesive with low bulk density silver powder as a conductive carrier and condensation type silicone as a matrix. Background technique [0002] In the electronics industry, conductive adhesive is an adhesive with certain conductive properties after curing or drying. It usually uses matrix resin and conductive particles as the main components, and the conductive particles are combined through the bonding effect of the matrix resin. Form a conductive path to realize the conductive connection of the adhered material. Since the matrix resin of the conductive adhesive is an adhesive, it can be cured and bonded at room temperature, which avoids material deformation, thermal damage of electronic devices, and internal stress formation that may be caused by heating and curing. [0003] Silicone has excellent weather resistance (high temperature, low te...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/04C09J9/02
CPCC08K2003/0806C09J9/02C09J183/04C08K3/08C08K7/18C08K7/00
Inventor 李志明孙玉海宋艳朱江
Owner 苏州瑞力博新材科技有限公司