A kind of low silver content condensation type silicone conductive adhesive and preparation method thereof
A condensation-type, conductive adhesive technology, applied in the direction of conductive adhesives, adhesives, etc., can solve the problems of high cost and high price of conductive adhesive materials, and achieve the effects of reducing material costs, improving storage time, and increasing specific surface area
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Embodiment 1
[0039] Under the condition of 25°C, weigh the proportion and weigh each component well, first add 30.5 parts of TMSS 1, 3 parts of methyl trimethoxy silicon and 65 parts of low bulk density silver powder TH05# into the planetary stirring tank, stir Simultaneously evacuate to 0.06-0.09MPa, stir at a constant speed for 1 hour, then add 0.5 part of dibutyltin diacetate under the protection of nitrogen, stir at a constant speed for 1 hour, discharge, and store in a sealed container.
[0040] After moisture curing for 7 days (25°C, 50RH%), measure the volume resistivity of the conductive adhesive (GB / T1410-2006).
Embodiment 2
[0042] Under the condition of 25°C, weigh the proportion and weigh each component. First, add 36.5 parts of TMSS 5, 5 parts of methyl tributanoximinosilane and 58 parts of low bulk density silver powder TH05# into the planetary stirring tank , stirred and evacuated to 0.06-0.09MPa at the same time, after stirring at a constant speed for 1 hour, then under the protection of nitrogen, add 0.5 parts of dibutyltin dioctoate, stir at a constant speed for 1 hour, discharge, and store in a sealed manner.
[0043] After moisture curing for 7 days (25°C, 50RH%), measure the volume resistivity of the conductive adhesive (GB / T1410-2006).
Embodiment 3
[0045] Under the condition of 25°C, weigh the proportion and weigh each component. First, add 10 42 parts of TMSS, 4.5 parts of methyltriethoxysilane and 53 parts of low bulk density silver powder TH05# into the planetary stirring tank. Stir and simultaneously evacuate to 0.06-0.09 MPa, stir at a constant speed for 1 hour, then add 0.5 parts of tetrabutyl titanate under the protection of nitrogen, stir at a constant speed for 1 hour, discharge, and seal for storage.
[0046] After moisture curing for 7 days (25°C, 50RH%), measure the volume resistivity of the conductive adhesive (GB / T1410-2006).
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