Mask and manufacturing method thereof

Abstract

The invention provides a mask and a manufacturing method thereof. The mask comprises a substrate and a mask pattern layer positioned on the first surface; the substrate has a first surface and a second surface which are arranged oppositely; multiple openings for running through the substrate are formed in the substrate; the substrate material is a material which can be subjected to a semiconductoretching process; the mask pattern layer material is a material which can be subjected to a semiconductor etching process; the mask pattern layer has pattern regions and shielding regions; at least one through hole is formed in each pattern region; the openings expose the pattern regions; each opening is opposite to one pattern region and exposes all through holes in the corresponding pattern region; and the shielding regions are positioned outside the pattern regions and opposite to the substrate. The mask is high in quality and higher in precision; and when the mask is used for an evaporation process of an organic layer, the deposition quality of the organic layer can be improved, and quality of a post-period product is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a mask and a manufacturing method thereof. Background technique [0002] Compared with the current liquid crystal display technology, Organic Light-Emitting Dide (OLED) has the advantages of large viewing angle, bright colors, and low power consumption. In recent years, the speed of industrialization has advanced by leaps and bounds. [0003] In the current manufacturing process of the OLED display panel, the organic light-emitting layer is usually formed by evaporation, and the evaporation of the organic light-emitting layer generally uses a metal mask. The opening quality and opening position accuracy of the metal mask directly affect the deposition quality of the organic light-emitting layer, which in turn affects the quality of later products. At present, the metal mask processing technology of OLED is usually prepared by chemical etching using Invar alloy (INVAR, als...

AI Technical Summary

Problems solved by technology

The opening quality and opening position accuracy of the metal mask directly affect the deposition quality of the organic light-emitting layer, which in turn affects the quality of later products

At present, the metal mask processing technology of OLED is usually prepared by chemical etching using Invar alloy (INVAR, also known as Invar). The fine pattern of the mask plate is transferred on the photosensitive film by means of developing and chemical etching to finally make a fine metal mask plate. The precision of this method is usually in the micron level, so the metal mask plate made The quality and accuracy cannot meet the requirements very well

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