A flexible printed circuit board
A flexible printed circuit and substrate technology, applied in printed circuit parts, circuit bendable/stretchable parts, etc., can solve problems such as difficulty in improving reliability, poor spatial stability, and breakage of integrated flexible printed circuit boards. Achieve the effect of improving thermal conductivity and heat dissipation, ensuring thickness and strength, and ensuring one-time molding
Active Publication Date: 2019-07-16
深圳市爱升精密电路科技有限公司
View PDF15 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
In this way, the solder bumps used for soldering are obviously protruded relative to the surface of the integrated flexible printed circuit board, which is easy to cause the integrated flexible printed circuit board to break at the welding position, resulting in the failure of the integrated flexible printed circuit board
[0004] Combining the above technical solutions and existing problems in reality, as well as combining the currently widely used technical solutions, the main defects are mainly reflected in the following aspects: poor thermal conductivity and heat dissipation, and difficult to control the transformation of the spatial structure and the specific size , which directly leads to its difficulty in improving its reliability; furthermore, because of the extremely poor dimensional stability and low wiring density, it is not convenient to make multilayer boards, and in the prior art, mechanical punching is used in the manufacture of multilayer flexible circuit boards. When the hole and mechanical cutting are used, it is easy to produce slag particles of various particle sizes, which will affect the performance of the circuit board
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0040] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0041] Such as Figure 1 to Figure 5 As shown, the present invention provides a flexible printed circuit board, including a flexible substrate 1, and a thermoplastic resin insulating layer 2 is provided on both surfaces of the flexible substrate 1, and the flexible substrate 1 and the thermoplastic resin insulating layer 2 There are signal wire groups 3 parallel to each other, and the signal wire groups 3 are all fixed by thermoplastic resin.
[0042] In the ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a flexible printed circuit board. The flexible printed circuit board comprises a soft substrate, thermoplastic resin insulation layers are arranged on two surfaces of the softsubstrate, signal line groups parallel to each other are arranged between the soft substrate and the thermoplastic resin insulation layers, the signal line groups are fixed through the thermoplastic resin, a plurality of irregular hard folded sheaths are arranged on the soft substrate, and hard folded sheaths at two ends rotate along two opposite directions around the long axle central line of thesoft substrate to form a rotating band on the soft substrate; the U-shaped film wrapped edges are arranged at the back side and the front side of the rotating band; the space stability is excellent and convenient for forming a three-dimensional multilayer circuit board structure, thereby directly performing folding, rotating and shaping. The batch product can be realized by adopting the same template, and the process is simplified, and the production efficiency is improved.
Description
technical field [0001] The invention relates to the technical field of circuit boards, in particular to a flexible printed circuit board. Background technique [0002] The flexible printed circuit board has the characteristics of thin thickness, light weight, dense wiring, bendable and flexible, and is widely used in the field of electronic devices. Flexible printed circuit boards have been widely used to provide wiring for movable parts of electronic devices. In addition, as electronic devices are reduced in size and functions of electronic devices are improved, flexible printed circuit boards by connecting several flexible printed circuit boards have been used. Flexible printed circuit board In some specific applications, it is even possible to solder at least two flexible printed circuit boards into an integrated flexible printed circuit board. [0003] Obviously, the thickness of the soldering position of the integrated flexible printed circuit is greater than the thic...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02
CPCH05K1/0278H05K1/0281
Inventor 方志彦
Owner 深圳市爱升精密电路科技有限公司