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Substrate transfer device and substrate transfer method

A substrate conveying and substrate technology, applied in chemical instruments and methods, separation methods, transportation and packaging, etc., can solve problems such as adverse environmental effects and inability to discharge gas

Active Publication Date: 2022-03-15
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Moreover, since such organic substances also have adverse effects on the environment outside the casing, the gas containing the organic substances cannot be directly discharged to the outside of the casing.

Method used

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  • Substrate transfer device and substrate transfer method
  • Substrate transfer device and substrate transfer method
  • Substrate transfer device and substrate transfer method

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Experimental program
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Embodiment Construction

[0032] Embodiments of the present invention will be described below with reference to the drawings. In addition, in this specification and drawings, the same code|symbol is attached|subjected to the element which has substantially the same functional structure, and repeated description is abbreviate|omitted.

[0033]

[0034] First, the configuration of a substrate processing system including an atmospheric pressure transfer device as a substrate transfer device of the present invention will be described. figure 1 It is a plan view showing the outline of the structure of the substrate processing system 1 . In the substrate processing system 1 , predetermined processing such as film formation processing, diffusion processing, and etching processing is performed on a semiconductor wafer W (hereinafter referred to as wafer W) serving as a substrate.

[0035] The substrate processing system 1 has a structure in which a cassette station 10 and a processing station 11 are integr...

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Abstract

The invention provides a substrate conveying device and a substrate conveying method. In a transfer device that transfers substrates to various processing devices, the cleanliness of the atmosphere inside the housing is maintained. The atmospheric pressure transfer device has: a wafer transfer mechanism that holds and transfers the wafer; a housing that accommodates the wafer transfer mechanism; a gas supply unit that supplies inert gas into the housing; and a gas circulation unit that discharges the gas from the housing. the gas returned to the casing; and a foreign substance removing part which removes foreign substances in the gas discharged from the casing. The gas circulation unit includes: a humidifying unit that adds moisture to the gas discharged from the housing; a filter that uses moisture in the gas to absorb and remove organic substances contained in the gas humidified by the humidifying unit; and a dehumidifying unit that Moisture is removed from gases that have been filtered to remove organic matter.

Description

technical field [0001] The present invention relates to a transfer device and a transfer method for transferring a substrate to a substrate processing apparatus. Background technique [0002] Conventionally, in the manufacturing process of semiconductor devices, for example, a coating and developing process of performing a series of photolithography processes such as resist coating, exposure, and development on a semiconductor wafer (hereinafter referred to as "wafer") is used. Various substrate processing systems, such as etching processing systems for etching wafers, and film formation processing systems for forming coating films on wafers. [0003] Generally, such a substrate processing system includes, for example, a pod station for loading and unloading a pod (FOUP; Front Opening Unified Pod: Front Opening Unified Pod) capable of accommodating a plurality of wafers, and a unit for performing predetermined processing on wafers. Multiple processing stations of various pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/677
CPCH01L21/67017H01L21/67196H01L21/67766H01L21/67778B01D53/04B01D2256/18B01D2257/70B01D53/261B01D53/06B01D2258/0216B01D2253/108B01D2256/10B01D2257/80B01D2259/40088H01L21/67167H01L21/67742H01L21/02B01D53/44H01L21/68707
Inventor 樱林务辻德彦
Owner TOKYO ELECTRON LTD