Copper alloy and application thereof

Abstract

The invention relates to a copper alloy and application thereof. The copper alloy comprises 5-15 wt% of Zn, 0.2-2.5 wt% of Sn, 0.1-2.0 wt% of Ni, 0.01-0.3 wt% of P, 0-0.3 wt% of Mg, 0-0.5 wt% of Fe, and the balance Cu and inevitable impurities. Preferably, Ni, Sn and P meet that the sum of Ni and Sn is larger than or equal to 1.0 wt% and smaller than or equal to 3.5 wt%, the weight ratio of Ni toSn is 0.08-10, the weight ratio of Ni to P is 2-15, and Ni and P form a NiP compound in a base body. In crystal orientation analysis measured by EBSD, the Brass orientation deviation angles (011)(211)are smaller than 15 degrees, and the area proportion is 10-25%. Meanwhile, the yield strength is larger than or equal to over 600 MPa, the electric conductivity is larger than or equal to 25% IACS, the bending machining performance is excellent, namely, a value R / t in the GW direction is smaller than or equal to 1, and a value R / t in the BW direction is smaller than or equal to 2. The copper alloy is applicable to connectors such as electric parts, car parts and communication devices, terminals and switch parts.

Description

technical field [0001] The invention relates to the field of alloys, in particular to a copper alloy and its application. Background technique [0002] For a long time, copper and copper alloy materials with good electrical conductivity and high strength have been used as important constituent materials for connectors, terminals, and switches such as electrical components, automotive components, and communication devices. With the miniaturization, weight reduction and high performance of devices in recent years, more stringent performance improvement requirements have been put forward for these constituent materials. These performances include the strength, electrical conductivity, stress relaxation resistance and bending performance of materials. [0003] Bending performance is an important factor affecting the application of materials. With the miniaturization of terminals, the bending radius of curvature of the contact part has become smaller, and more stringent bending p...

AI Technical Summary

Problems solved by technology

However, in the above-mentioned technology, because the aggregation with the specific crystal plane defined by {200}, {220}, {311}, etc. in the distribution of crystal orientation with a certain width is only a small part of the information in the crystal plane distribution, only a small part Depending on the specific plane, the orientation of crystal planes may not be sufficiently controlled and the effect of improving bending performance may not be sufficient

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