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Semiconductor light emitting device

一种发光器件、半导体的技术,应用在半导体器件、电气元件、电路等方向,能够解决降低发光器件发光效率等问题,达到改善电流扩散效应、大发光区域、防止电流扩散的效果

Active Publication Date: 2018-11-13
SEOUL VIOSYS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] At this time, the injected current is likely to be concentrated around the irregular part of the hole electrode, and this concentration of current inevitably reduces the luminous efficiency of the light-emitting device.

Method used

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  • Semiconductor light emitting device
  • Semiconductor light emitting device
  • Semiconductor light emitting device

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Experimental program
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Embodiment Construction

[0079] Exemplary embodiments will be described in more detail below with reference to the accompanying drawings. However, the invention may be embodied in different forms and should not be construed as being limited to the embodiments. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Throughout the invention, the same reference numerals represent the same components in different drawings and different embodiments of the invention.

[0080] Hereinafter, a semiconductor light emitting device and a method of manufacturing the same according to an embodiment of the present invention will be described with reference to the accompanying drawings. In the embodiments of the present invention, a nitride semiconductor will be taken as an example. However, the present invention is not limited thereto.

[0081] A method of manufacturing a nitride semiconductor acco...

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Abstract

A semiconductor light emitting device is provided that may include: a light emitting structure in which a conductive substrate, a second conductive type semiconductor layer, an active layer, and a first conductive type semiconductor layer are stacked; a diffusion metal layer and an insulating layer disposed between the conductive substrate and the second conductive type semiconductor layer; and areflecting electrode layer disposed under the second conductive type semiconductor layer, wherein a top surface of the reflecting electrode layer, facing the second conductive type semiconductor layer, has a smaller area than a bottom surface of the second conductive type semiconductor layer, the diffusion metal layer forms a plurality of via holes extended to an inside of the first conductive type semiconductor layer through the insulating layer, the second conductive type semiconductor layer, and an active layer, and electrically couples the diffusion metal layer to the first conductive typesemiconductor layer through the via holes, and a shortest distance D2 between an arbitrary via hole and another via hole adjacent to the via hole is larger than a shortest distance D3 between the viahole which is the closest to an outside of the first conductive type semiconductor layer and an outside of the second conductive type semiconductor layer.

Description

[0001] This application is a divisional application of a patent application entitled "Semiconductor Light Emitting Device" with an application date of December 17, 2015 and an application number of 201510954206.2. technical field [0002] The present invention relates to a nitride semiconductor light-emitting device, and more particularly, to a semiconductor light-emitting device capable of improving optical efficiency and having a simple structure, a method for preparing the semiconductor light-emitting device, and a light-emitting device including a structure for improving the current diffusion effect . Background technique [0003] A semiconductor light emitting device (such as a nitride semiconductor light emitting device) generally includes a light emitting structure, a first electrode (such as an n-electrode or an n-electrode pad) and a second electrode (such as a p-electrode or a p-electrode pad). The light-emitting structure includes a first conductive type semicondu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/38H01L33/22H01L33/20H01L33/00
CPCH01L33/38H01L33/40H01L2933/0016H01L33/20H01L33/22H01L33/382H01L33/0093H01L33/24H01L33/32H01L33/405
Inventor 李美姬李俊熙李所螺张美萝
Owner SEOUL VIOSYS CO LTD