Three-dimensional integrated intelligent power module and manufacturing method thereof

Abstract

The invention discloses a three-dimensional integrated intelligent power module and a manufacturing method thereof. The three-dimensional integrated intelligent power module comprises a power switch circuit, a drive circuit, a master control circuit and a state monitoring and protecting circuit and is characterized in that the master control circuit and the state monitoring and protecting circuitare connected with the power switch circuit and the drive circuit thereof, the master control circuit is assembled to an upper substrate, the state monitoring and protecting circuit is assembled to alower substrate, the upper substrate and the lower substrate are connected with each other by through guide holes to form a three-dimensional intelligent control unit, and the power switch circuit andthe drive circuit thereof are welded to a high-heat-conductivity substrate and connected with the intelligent control unit through lead welding. The intelligent power module has the advantages that the intelligent power module integrates the power switch circuit and the drive circuit thereof, the master control circuit and the state monitoring and protecting circuit; by using the three-dimensional integration form, module power density can be increased, device size can be reduced, the length of the lead between power semiconductor device pins is shortened, parasitic parameters and noise peakvoltage are lowered, and the application reliability of power devices is increased.

Description

technical field [0001] The invention belongs to the field of electronic technology, and more specifically relates to an intelligent power module and a manufacturing method thereof. Background technique [0002] The intelligent power control module integrates the power switching device, switch drive circuit, main control circuit and protection circuit into one package through system-level packaging technology, and the main control circuit is responsible for processing the collected or control input data and realizing various control Algorithms, send control signals to the power circuit through the output interface, and output the calculation results to the peripheral equipment, receive instructions from the peripheral equipment and perform corresponding operations. This integrated module simplifies device setup when dealing with different functional environments, and has significant advantages such as compact structure, powerful functions, flexible configuration and easy inst...

AI Technical Summary

Problems solved by technology

The current intelligent power module generally only integrates a driving circuit and a simple protection circuit inside, and the protection circuit is not perfect, and an additional processor is required to realize the intelligent control algorithm, which increases the complexity of module manufacturing, resulting in long design cycles for users and low production efficiency. higher cost

Existing intelligent power modules mainly adopt the planar assembly method, the module volume is large, the power density is low, the interconnection distance is long, and the parasitic parameters are large, which increases the electromagnetic interference of the module

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