Pyrolysis method synthesis strong combination-based copper coated graphene reinforced high-strength Sn-Ag-Cu-RE series composite brazing filler metal and preparation method

A sn-ag-cu-re, copper-plated graphene technology, applied in manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problem of less wettability than nickel, improve performance, inhibit spontaneous agglomeration, reduce The effect of material cost

Inactive Publication Date: 2018-11-16
HENAN UNIV OF SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

As a cheap element, Cu nanoparticles are often used to prepare Cu in situ 6 sn 5 IMC precipitated phase strengthens Sn-based lead-free solder. Compared with nickel, copper is generally considered to have stronger bonding strength between nickel and graphene, and the wettability of copper when used for solder is not as good as that of nickel. Therefore, there are currently few There is research on copper plating on the surface of graphene to enhance the performance of solder

Method used

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  • Pyrolysis method synthesis strong combination-based copper coated graphene reinforced high-strength Sn-Ag-Cu-RE series composite brazing filler metal and preparation method
  • Pyrolysis method synthesis strong combination-based copper coated graphene reinforced high-strength Sn-Ag-Cu-RE series composite brazing filler metal and preparation method
  • Pyrolysis method synthesis strong combination-based copper coated graphene reinforced high-strength Sn-Ag-Cu-RE series composite brazing filler metal and preparation method

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preparation example Construction

[0040] The preparation method of a kind of pyrolysis synthesis of the high-strength Sn-Ag-Cu-RE composite brazing filler metal that is strongly combined with copper-plated graphene reinforced by the present invention comprises two major steps:

[0041] Step (1) Prepare copper-coated graphene by pyrolysis method to obtain copper-coated graphene strengthening phase;

[0042]Step (2) Mix the copper-coated graphene-reinforced phase obtained in step (1) with Sn-Ag-Cu-RE lead-free solder and prepare copper-coated graphene-reinforced high-strength Sn- Ag-Cu-RE composite solder.

[0043] The above step (1) specifically includes the following steps:

[0044] Step 1.1, place the pre-weighed graphene nanosheets in a high-energy ball mill for high-energy ball milling at a speed of 500r / min, and a ball milling time of 3 hours. After the ball milling, take it out for use;

[0045] Step 1.2. Mechanically mix the ball-milled GNSs with copper acetate (Cu(CH3COO)2•H2O) powder to obtain a unif...

Embodiment 1

[0056] Step (1): preparing copper-coated graphene by pyrolysis method to obtain a copper-coated graphene strengthening phase;

[0057] Step 1.1. Place the pre-weighed graphene nanosheets in the XQM-0.4L planetary ball mill for high-energy ball milling with a rotation speed of 500r / min and a ball milling time of 3 hours. After the ball milling, take it out for use;

[0058] Step 1.2. Mechanically mix the ball-milled GNSs with copper acetate (Cu(CH3COO)2•H2O) powder to obtain a uniformly colored mixed powder. Set the loading ratio to 10mol.%, that is, the amount of copper atomic substances is the amount of carbon atomic substances 1 / 10 of;

[0059] Step 1.3, place the uniformly mixed powder in a tube furnace with nitrogen, keep it warm at 500°C for 3 hours, and then cool to room temperature with the furnace to obtain copper-coated graphene.

Embodiment 2

[0061] Step (1): preparing copper-coated graphene by pyrolysis method to obtain a copper-coated graphene strengthening phase;

[0062] Step 1.1. Place the pre-weighed graphene nanosheets in the XQM-0.4L planetary ball mill for high-energy ball milling with a rotation speed of 500r / min and a ball milling time of 3 hours. After the ball milling, take it out for use;

[0063] Step 1.2. Mechanically mix the ball-milled GNSs with copper acetate (Cu(CH3COO)2•H2O) powder to obtain a uniformly colored mixed powder. Set the loading ratio to 10mol.%, that is, the amount of copper atomic substances is the amount of carbon atomic substances 1 / 10 of;

[0064] Step 1.3, place the uniformly mixed mixed powder in a tube furnace with nitrogen, keep it warm at 450°C for 5h, and then cool to room temperature with the furnace to obtain copper-coated graphene.

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Abstract

The invention relates to a pyrolysis method synthesis strong combination-based copper coated graphene reinforced high-strength Sn-Ag-Cu-RE series composite brazing filler metal and a preparation method. The additive amount of copper coated graphene is 0.01-0.11% in mass fraction. Through coating copper on graphene, the problems that the graphene spontaneously reunite and lead-free brazing filler metal matrixes are bad in moisture are solved; and by adoption of a pyrolysis method, the copper coated graphene is synthesized, Cu nanoparticles are uniformly distributed on the surface of graphene, so that strong combination is formed to prepare copper coated graphene reinforced high-strength Sn-Ag-Cu-RE series composite brazing filler metal, thereby enhancing the performance of the composite brazing filler metal.

Description

technical field [0001] The invention relates to the field of brazing materials, in particular to a copper-plated graphene reinforced Sn-Ag-Cu-RE composite solder. Background technique [0002] Solder plays the role of electrical and mechanical interconnection in electronic package assembly and has a significant impact on the reliability of micro-connection solder joints. With the miniaturization and lightweight trend of electronic products and the enhancement of people's awareness of environmental protection, my country's unique Sn-Ag-Cu-RE lead-free solder has become one of the most promising substitutes for Sn-Pb solder . However, compared with the original Sn-Pb solder, there are still various deficiencies, such as poor wettability with the copper substrate, poor mechanical properties, etc., and it is urgent to further improve its performance to adapt to the harsh service environment. demanding. [0003] In recent years, adding graphene to solder including lead-free sol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/40
CPCB23K35/262B23K35/40
Inventor 张柯柯张萌尹宸翔马宁潘毅博张超王悔改霍福鹏赵迪
Owner HENAN UNIV OF SCI & TECH
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