Circuit board adhesive film forming structure and adhesive film forming method
A technology for bonding adhesive films and forming methods, applied in the directions of printed circuits, printed circuit manufacturing, electrical components, etc., can solve the problems of adhesion, poor dimensional accuracy, edge burrs, etc. The effect of edge burrs
Active Publication Date: 2018-11-20
XIAN MICROELECTRONICS TECH INST
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Problems solved by technology
[0003] In order to solve the problems existing in the prior art, the present invention discloses a method for forming the adhesive film of the printed circuit board of the cold plate, which solves the problem of high edge burrs during the shape processing of the adhesive film of the cold plate printed circuit board, Poor dimensional accuracy, sticking problems during processing
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[0022] The present invention will be further explained below in conjunction with the accompanying drawings and embodiments.
[0023] The present invention forms a laminated structure of six layers of four materials, which are core plate, isolation film, adhesive film, isolation film, core plate and heat dissipation plate from bottom to top through stacking and bonding in a fixed order. The aluminum plate is used as the heat dissipation plate, and the epoxy light plate is used as the core plate material. With the processing and milling process, it can effectively solve the problem of high edge burrs, poor dimensional accuracy, and adhesion of the adhesive film of the cold plate printed board during shape processing. The problem.
[0024] A structure for forming a circuit board adhesive film, including two core boards 1 and two isolation films 2, the core boards 1 are respectively arranged on the top and bottom, and the isolation film 2 is arranged between the two core boards 1,...
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The invention discloses a circuit board adhesive film forming structure. The circuit board adhesive film forming structure comprises two core plates and two isolation films; the core plates are arranged at the top and the bottom respectively, and the isolation films are arranged between two epoxy light plates, and an adhesive film is arranged between the two epoxy light plates; clamps are arrangedon the two epoxy light plates to clamp the two epoxy light plates up and down; the invention further discloses a circuit board adhesive film forming method; according to the sequence, the two core plates, the two isolation films, and the adhesive film are subjected to stacking and fixing; then positioning and milling are carried out; and processing of a required model adhesive film is completed,so that the problems of edge burrs, poor dimensional precision and softening and adhesion in the process of processing the appearance of the adhesive film of the cold plate printed circuit board are effectively solved; and the processing precision and quality of the adhesive film of the cold plate printed circuit board are improved, so that the adhesive film can be better suitable for the cold plate printed board with more complex structure and higher demand, and the processing capacity of the cold plate printed circuit board is improved.
Description
technical field [0001] The invention belongs to the field of cold plate printed circuits, and in particular relates to a structure for forming a circuit board adhesive film and a method for forming the film. Background technique [0002] As electronic equipment becomes thinner and smaller, high-density installation and CPU use frequency increase, printed circuit boards for electronic interconnection are developing towards high density and high precision, thus requiring high-power printed circuit board assemblies It has excellent heat dissipation performance and dimensional stability. The cold plate printed board can effectively solve the problem of heat dissipation, so that the dimensional stability of the printed board is guaranteed, and the problem of thermal expansion and contraction of different materials on the printed board is alleviated, and the reliability of the whole machine and electronic equipment is improved. sex and longevity. Adhesive film is the core materi...
Claims
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IPC IPC(8): H05K3/00
CPCH05K3/0014H05K3/0044
Inventor 杨乐安金平高原
Owner XIAN MICROELECTRONICS TECH INST