A device for enhancing the rapid detachment of bubbles on a boiling surface and a manufacturing method thereof
A technology of enhanced boiling and rapid detachment, applied in electrical components, semiconductor/solid-state device parts, semiconductor devices, etc., can solve problems such as deterioration of heat transfer process, difficulty in rehydration, film boiling, etc., to improve critical heat flux density, structure The effect is obvious, and the effect of accelerating condensation and collapse
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[0031] Below in conjunction with accompanying drawing, the present invention is described in further detail:
[0032] Referring to the accompanying drawings, a device for enhancing the rapid detachment of bubbles on the surface of boiling, in which a multi-scale enhanced boiling heat transfer structure 2 is arranged on the base 1, and a hydrophobic and aerophilic bubble assisted detachment structure is added vertically above the enhanced boiling heat transfer structure 2 3. Through the bubble-assisted detachment structure 3, the vertical detachment of the bubbles from the heat exchange surface is accelerated. At the same time, the bubble-assisted detachment structure 3 is equipped with a condenser 4, and the built-in gas channel 5 of the condenser 4 is still a hydrophilic surface, which is conducive to non-condensation The rapid detachment of the gas enhances the effect of liquid replenishment during heat exchange; at the same time, the outer surface of the condenser 4 is a hyd...
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