Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Circuit printing method through uniform metal liquid drops

A metal droplet, uniform technology, applied in other manufacturing equipment/tools, turbines, engine components, etc., can solve the problems of poor practicability, achieve good practicability, meet the bonding strength, and reduce post-processing effects

Active Publication Date: 2018-11-30
NORTHWESTERN POLYTECHNICAL UNIV
View PDF3 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the shortcomings of the poor practicability of the existing microelectronic circuit manufacturing methods, the present invention provides a method for printing circuits with uniform metal droplets

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit printing method through uniform metal liquid drops
  • Circuit printing method through uniform metal liquid drops
  • Circuit printing method through uniform metal liquid drops

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Example 1. Printing of electronic circuits on thermoplastic substrates.

[0027] Lead-tin alloy (ZHLZn60PbA) was used as the printing material, and organic glass (polymethyl methacrylate) was used to process the thermoplastic substrate 2. First, heat the lead-tin alloy inside the crucible to 300°C-400°C, match the pressure amplitude, pulse width and frequency of the metal droplet injection, and realize the stable injection of a single uniform metal droplet 1.

[0028] in accordance with:

[0029] T d > T g (1)

[0030] ρV d C(T d -T s )>ρV 搭接 C(T d -T s )+ρV 搭接 H (2)

[0031] Calculate the temperature T of the high-temperature metal droplet 1 d with thermoplastic matrix 2 temperature T s . T d The value range is: T d =300℃~400℃, T s The value range is: T s =100°C to 200°C. The metal droplet 1 is sprayed with a diameter of about 200-500 μm, so that it is precisely positioned on the surface of the thermoplastic substrate 2 . The metal droplet 1 melts...

Embodiment 2

[0035] Example 2. Fast printing of highly conductive electronic circuits on high melting point substrates.

[0036] For high-melting-point insulating substrates 5 such as glass and ceramics, a thermoplastic layer 2 is firstly coated on the surface to prepare a composite substrate for printing metal droplets 1 . The gold-tin alloy (AuSn30) was used as the printing material, and the personalized circuit was directly printed on the prepared composite substrate.

[0037] in accordance with:

[0038] T d > T g (1)

[0039] ρV d C(T d -T s )>ρV 搭接 C(T d -T s )+ρV 搭接 H (2)

[0040] Calculate the temperature T of the high-temperature metal droplet 1 d with thermoplastic matrix 2 temperature T s . T d The value range is: T d =400℃~500℃, T s The value range is: T s =100°C to 200°C. Spray metal droplet 1 with a diameter of about 200-500 μm, and conduct gold-tin alloy droplet deposition test on thermoplastic substrate 2 to obtain good fusion between metal droplet 1 and ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses a circuit printing method through uniform metal liquid drops. The technical problem that an existing microelectronic circuit manufacturing method is poor in practicability is solved. According to the technical scheme, a block metal material in a market supply state is melted, the metal liquid drops in a molten state are sprayed out for printing drop by drop, and through metallurgical bonding among the printing metal liquid drops, it is guaranteed that the electrical conductivity of a printed conducting circuit is the same as that of a dense metal material. Meanwhile, through deposition of the high-temperature liquid drops, a thermoplastic matrix is melted so as to form the conducting circuit with the bottoms of the metal liquid drops being embedded into the matrix,the requirement for the bonding strength of the conducting circuit can be met, the post-processing process of the circuit is reduced, low-cost short-process printing of the circuit is realized, and practicability is good.

Description

technical field [0001] The invention relates to a method for manufacturing a microelectronic circuit, in particular to a method for printing a circuit with uniform metal droplets. Background technique [0002] With the development of electronic products in the direction of ultra-large-scale integration, digitalization, lightweight and personalization, the current research on multi-sensing microsystems and optoelectronic processes urgently needs to be able to personalize, High-efficiency wiring can greatly improve the production efficiency and precision of electronic products, save time and cost, which poses a challenge to the traditional circuit manufacturing process. The traditional circuit manufacturing process mostly adopts mask-based screen printing process, which is suitable for the production of large-scale standardized products, and it is difficult to meet the rapid manufacturing of advanced microelectronics such as 3D circuits, organic photoelectric circuits, and pho...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/115B22F5/00
CPCB22F3/115B22F5/00
Inventor 罗俊齐乐华赵蕾莫远兵
Owner NORTHWESTERN POLYTECHNICAL UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com