Surface grinding device for wafer producing and processing
A surface grinding and wafer technology, applied in the direction of grinding devices, grinding machine tools, metal processing equipment, etc., can solve the problems of damage, poor adaptability, poor reliability, etc., to improve the clamping effect, ease the clamping hardness, and improve the adaptability effect of ability
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[0020] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0021] Such as Figure 1 to Figure 6As shown, a surface grinding device for wafer production and processing of the present invention includes a workbench 1 and four sets of legs 2, and the tops of the four sets of legs are respectively connected to the left front side, left rear side, and right front of the bottom end of the workbench. The side and the right rear side are connected, and the top right side of the workbench is placed with a grinding disc 3; including a fixed disc 4, a left arc-shaped adjustment plate 5, a right arc-shaped adjustment plate, a left arc-shaped splint 6, a right arc-shaped splint, a left Adjusting bolt 7, right adjusting bolt, left limit ring 8...
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