Surface grinding device for wafer producing and processing

Abstract

The invention relates to the technical field of accessory devices, in particular to a surface grinding device for wafer producing and processing. The surface grinding device can improve the clamping effect, can adapt clamping of wafer slicing with different sizes, and meanwhile the wafer slicing is prevented from being damaged in the clamping process; and the surface grinding device does not needthat a polishing sand tray is manually used to polish the surface of the top end of the wafer slicing, manpower is saved, the levelness of a polishing surface can be guaranteed, the polishing effect is improved, and the practicability is improved. The surface grinding device comprises a workbench, four groups of support legs, a fixing disk, a left arc-shaped adjusting plate, a right arc-shaped adjusting plate, a left arc-shaped clamping plate, a right arc-shaped clamping plate, a left adjusting bolt, a right adjusting bolt, a left limiting ring, a right limiting ring, multiple groups of left buffer springs, multiple groups of right buffer springs, two groups of left threaded pipes, two groups of left threaded rods, two groups of right threaded pipes, two groups of right threaded rods, a fixing block, two groups of left limiting square columns, two groups of right limiting square columns, a moving block, a driving motor, a rocker arm, a annular adjusting ring, a mounting plate, a limiting ring and a telescopic rod.

Description

technical field [0001] The invention relates to the technical field of accessory devices, in particular to a surface grinding device for wafer production and processing. Background technique [0002] As we all know, the surface grinding device used for wafer production and processing is a kind of grinding of the knife marks and concave-convex surfaces caused by slicing on the surface of the wafer slices after slicing, so as to better regulate the thickness of the wafer slices and reduce the gap between slices and slices. The thickness difference between them and the auxiliary device for improving the parallelism have been widely used in the field of wafer production and processing; the existing surface grinding device for wafer production and processing includes a workbench, four sets of legs, Placement plate, left clamping plate and right clamping plate, the tops of the four sets of outriggers are respectively connected with the left front side, left rear side, right front ...

AI Technical Summary

Problems solved by technology

[0002] As we all know, the surface grinding device used for wafer production and processing is a kind of grinding of the knife marks and concave-convex surfaces caused by slicing on the surface of the wafer slices after slicing, so as to better regulate the thickness of the wafer slices and reduce the gap between slices and slices. The thickness difference between them and the auxiliary device for improving the parallelism have been widely used in the field of wafer production and processing; the existing surface grinding device for wafer production and processing includes a workbench, four sets of legs, Placement plate, left clamping plate and right clamping plate, the tops of the four sets of outriggers are respectively connected with the left front side, left rear side, right front side and right rear side of the bottom end of the workbench, and the bottom end of the placement plate is connected with the middle part of the top of the workbench , the bottom ends of the left clamping board and the right clamping board are respectively connected with the left side and the right side of the top of the placing plate, and a grinding disc is placed on the right side of the top of the workbench; the existing surface grinding device for wafer production and processing is used At this time, first place the wafer slice to be polished on the placement plate, and clamp the wafer slice through the left clamping plate and the right clamping plate, and then manually use the grinding disc to grind the top surface of the wafer slice; In the use of the existing surface grinding device for wafer production and processing, it is found that the contact area between the left and right clamps and the left and right ends of the wafer slice is small, resulting in poor clamping effect and cannot adapt to different sizes. The clamping of the wafer slices has poor adaptability, and at the same time, the left and right ends of the wafer slices are easily damaged by the left clamping plate and the right clamping plate during the clamping process of the wafer slices, resulting in poor reliability in use; and Manually use a grinding disc to polish the top surface of the wafer slice, which wastes a lot of manpower, and cannot guarantee the levelness of the grinding surface, which affects the grinding effect and leads to poor practicability

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