Radio-frequency amplifier of integrated prefilter and packaging method thereof

Abstract

The invention provides a radio-frequency amplifier of an integrated prefilter and a packaging method thereof. A high-order LC band-pass filter is disassembled into three filter units, and the three filter units are respectively arranged on a packaging substrate, the front end of an amplifier, and in an amplifier stage. Comprehensive frequency response is approximate to relatively ideal high-orderband-pass filter response. Insertion loss of the amplifier is low, and the amplifier can satisfy filter processing requirement in current mobile communication. Further, design of the filter fully usesinductance assemblies distributed in an original amplifier, the inductance assemblies including input series inductance, source electrode inductance, and the like, and furthermore, device area and costs are saved.

Description

technical field [0001] The invention relates to the field of signal amplification and processing, in particular to a radio frequency amplifier integrating a pre-filter and a packaging method thereof. Background technique [0002] The traditional surface acoustic wave filter (SAW) is a kind of transducing non-conductive filter made of the piezoelectric effect of piezoelectric quartz crystal oscillator materials such as piezoelectric ceramics, lithium niobate, and quartz, and the physical characteristics of surface acoustic wave propagation. The source bandpass filter is a special filtering device made of piezoelectric materials such as quartz crystals and piezoelectric ceramics, using its piezoelectric effect and the physical characteristics of surface acoustic wave propagation. Its spectral response is similar to that of a high order LC bandpass filter. [0003] The piezoelectric effect existing in crystals with certain symmetry is the "motor" and "generator" of the surface...

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Problems solved by technology

But SAW filters have limitations: above about 1 GHz, their selectivity decreases; at about 2.5 GHz, their use is limited to applications that do not require high performance

[0007] figure 2 It shows the schematic diagram of the SKY65713 chip of Skyworks in the United States. It can be seen from the figure that it is a highly integrated RF front-end chip integrating pre-filter and low-noise amplifier. It uses two wafers inside, of which The pre-filter is a single one, and the low-noise amplifier together with the bias circuit and output matching is another one. An off-chip inductor is required from the output of the pre-filter to the input of the low-noise amplifier. Therefore, the scheme The cost is high, and the user is more complicated to use

[0008] It can be seen from the above that the cost of the existing SAW filter is relatively high, and it is difficult to be compatible with the RF amplifier of the CMOS process; and the traditional on-chip low-order LC cannot realize a resonant cavity with a high quality factor, which will cause serious insertion loss (insertion loss) , resulting in a severe deterioration of the sensitivity

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