A method for optimizing the heat dissipation structure of the micro-channel of a multi-chip module

A technology of multi-chip components and optimization methods, applied in design optimization/simulation, special data processing applications, instruments, etc., can solve problems that take a lot of time and energy, and achieve the effect of simple calculation and convenient parameter optimization design

Inactive Publication Date: 2018-12-14
GUILIN UNIV OF ELECTRONIC TECH
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Problems solved by technology

The optimization process of the structure is often to put forward an idea first, and then make the corresponding structure on this basis. After the finished product is made, it is necessary to do the corresponding component heating test

Method used

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  • A method for optimizing the heat dissipation structure of the micro-channel of a multi-chip module
  • A method for optimizing the heat dissipation structure of the micro-channel of a multi-chip module
  • A method for optimizing the heat dissipation structure of the micro-channel of a multi-chip module

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Embodiment

[0028] A method for optimizing the heat dissipation structure of a multi-chip component microchannel, first of all, for the microchannel structure in the substrate, the structural factors that affect the heat dissipation performance of the substrate are proposed, which is the selection of factors in the orthogonal test design, and then the corresponding structural factors are designed. level variable. In this case, first use the orthogonal design method to design an orthogonal table for experimental design. This time, 9 sets of test combinations are designed. According to these 9 sets of test parameters, corresponding 9 sets of simulation models are established. After the simulation calculation, the corresponding temperature results are obtained. After the range analysis of the obtained data, the primary and secondary relationship of the factors affecting the heat dissipation performance of the basic microchannel structure can be obtained. The significance of the influencing f...

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Abstract

The invention discloses a method for optimizing the heat dissipation structure of the micro-channel of a multi-chip module. The diameter of the micro-channel in the multi-chip module, the microchannelstructure, and the inlet velocity of the micro-channel coolant is taken as a design parameters, and the high temperature in the finite element model is taken as the target value, and nine groups of effective test simulation are designed. Range analysis is preformed on the experimental result data through the orthogonal design experiment method, and the optimized combination and the primary and secondary relationship of the influencing factors can be obtained. Through the experimental results, the variance analysis can be made, and the significant influence of the influencing factors on the heat dissipation performance of the micro-channel can be obtained. This method also has a guiding role in the optimization design of other interconnection structures.

Description

technical field [0001] The invention relates to heat dissipation optimization technology of electronic components in microelectronic packaging, in particular to an optimization method of heat dissipation structure of multi-chip assembly micro-channel based on orthogonal test design. Background technique [0002] With the increasing demand for more functions, smaller size and higher integration of electronic products such as smart phones, tablet computers, mobile storage devices and automotive electronic devices, the power of circuits in electronic products has increased significantly, which will inevitably This leads to a sharp increase in the heat of the entire electronic product system. According to the latest research results, at room temperature, when the temperature of electronic components increases by 10°C, the service life of electronic components will be halved. This is the "10°C rule". Moreover, when the temperature is between 70°C and 80°C, the reliability will de...

Claims

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Application Information

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IPC IPC(8): G06F17/50
CPCG06F30/17G06F30/23
Inventor 黄春跃何伟路良坤王建培赵胜军唐香琼
Owner GUILIN UNIV OF ELECTRONIC TECH
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