Preparation method of flexible sensor
A flexible sensor and strain sensing technology, which is applied in the semiconductor field to achieve the effects of improving in-plane integration, improving fabrication efficiency and saving space
Active Publication Date: 2019-09-20
TSINGHUA UNIV
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This poses a challenge for the fabrication of flexible electronic devices
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[0040] Various exemplary embodiments, features, and aspects of the present disclosure will be described in detail below with reference to the accompanying drawings. The same reference numbers in the figures indicate functionally identical or similar elements. While various aspects of the embodiments are shown in drawings, the drawings are not necessarily drawn to scale unless specifically indicated.
[0041] The word "exemplary" is used exclusively herein to mean "serving as an example, embodiment, or illustration." Any embodiment described herein as "exemplary" is not necessarily to be construed as superior or better than other embodiments.
[0042] In addition, in order to better illustrate the present disclosure, numerous specific details are given in the following specific implementation manners. It will be understood by those skilled in the art that the present disclosure may be practiced without some of the specific details. In some instances, methods, means, componen...
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The invention relates to a preparation method of a flexible sensor. The preparation method comprises the steps of sequentially generating a sacrificial layer and a substrate layer on a base; sputtering a metal layer on the substrate layer; performing first photo-etching and etching processing on the metal layer to form a strain sensor device; coating a photosensitive layer on the strain sensor device and the substrate layer; performing second photo-etching and etching processing on the photosensitive layer to form an optical waveguide; integrating a light source and a photoelectric detector ata position, corresponding to the optical waveguide, on the substrate layer so that the light source, the photoelectric detector and the optical waveguide form the optical sensor device; packaging thesubstrate layer, the strain sensor device and the optical sensor device by use of a packaging layer so that the substrate layer, the strain sensor device, the optical sensor device and the packaginglayer form the flexible sensor; and dissolving the sacrificial layer so that the flexible sensor and the base are separated. According to the reparation method of the flexible sensor, the strain sensor device and the optical sensor device with complicated double-layer structures are molded once through large-range photo-etching, and the preparation efficiency of the flexible sensor is improved.
Description
technical field [0001] The present disclosure relates to the technical field of semiconductors, in particular to a method for preparing a flexible sensor. Background technique [0002] Sensors in flexible electronic devices involve various sensing principles such as mechanics, electricity, magnetism, optics, biology, and chemistry, and are widely used in medical and health fields. With the development of science and technology, flexible electronic sensing devices are developing in the direction of multi-function and miniaturization, which requires integrating as many sensors as possible on the electronic sensing devices, while ensuring that the flexible electronic devices are as small as possible and compact. This poses a challenge to the fabrication of flexible electronic devices. Contents of the invention [0003] In view of this, the present disclosure proposes a method for preparing a flexible sensor. [0004] According to an aspect of the present disclosure, a meth...
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IPC IPC(8): G01B7/16G01B11/16
Inventor 冯雪刘鑫陈毅豪
Owner TSINGHUA UNIV