Heat source simulation devices for measuring heat flow density of spray cooling experiment system

A technology for simulating devices and heat flux density, applied in the direction of material thermal development, etc., can solve problems such as insufficient safety alarms, insufficient stability, single simulated heat source, etc., and achieve the effects of easy access, compact device structure layout, and large adjustment range

Pending Publication Date: 2018-12-21
HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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Problems solved by technology

[0005] In order to better apply spray cooling to actual production, meet the simulation requirements of different power heat sources and the experimental requirements of heat dissipation and heat conduction heat flow density calculation in spray cooling experiments, and overcome the single situation of simulated heat sources, insufficient stability, and safety alarms in previous schemes Insufficient defects make the design of the test bench safer and more stable at the same time. The invention provides a design scheme of the simulated heat source device that can measure the heat flux density

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  • Heat source simulation devices for measuring heat flow density of spray cooling experiment system
  • Heat source simulation devices for measuring heat flow density of spray cooling experiment system

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Embodiment Construction

[0018] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0019] The heat source simulation device used in the spray cooling experimental system of the present invention, which can measure and calculate the heat flux density, mainly includes two parts: a ceramic heating part and a heat conduction column measuring and calculating heat flux density part.

[0020] The ceramic heating part is mainly composed of silicon electronic voltage regulator, electrical parameter measuring instrument, ceramic heating ring, heat insulation cotton, sheet radiator and so on. The mains supplies power to the ceramic heating coil through the silicon electronic voltage regulator. The electronic voltage regulator and the ceramic heating coil are connected in series to the current detection part of the electrical parameter tester. The ring is placed in a vertical circle, the middle is a sheet-like heat sink (there is a circu...

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Abstract

The invention provides heat source simulation devices for measuring heat flow density of a spray cooling experiment system, which is mainly applied to a spray cooling or jet cooling test bench and belongs to the field of heat dissipation measurement. For the problem that the heat flow density of heat dissipation in a spray cooling experiment or a jet cooling experiment is not well calculated, theinvention designs a set of relatively reliable heat source simulation devices by changing an input voltage to adjust the simulated heat source power and collecting temperatures of different sections with one-dimensional heat transfer on the heat conducting column to calculate the heat flow density. The device mainly comprises two parts of a ceramic heating part and a heat conducting column measuring heat flow density part, wherein the ceramic heating part is mainly composed of a silicon electronic voltage regulator, an electric parameter measuring instrument, a ceramic heating ring, an insulating cotton, a sheet heat sink and the like; and the heat conducting column measuring heat flow density part is mainly composed of a heat conducting brass column, a thermocouple, an insulating cotton and the like. The device provided by the invention has the advantages such as wide simulation range, stable measurement, simple and safe operation.

Description

technical field [0001] The invention belongs to the field of spray cooling experiments or jet cooling experiments, and more specifically relates to a simulated heat source device which can measure and calculate the heat flux density and is applied to the heat dissipation and cooling experiment platform. Background technique [0002] With the rapid development of science and technology, the power density of electronic components such as electronic high-performance chips, large-scale radars, and high-end servers is increasing year by year. The ensuing heat accumulation and temperature increase have a great negative impact on the service life and performance stability of the equipment. Therefore, efficient heat dissipation in a limited space has become a bottleneck in the development of high-performance, highly integrated electronic devices. The heat generated by high-power electronic equipment is mainly transferred from the inside of the package to the outside of the package t...

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Application Information

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IPC IPC(8): G01N25/20
CPCG01N25/20
Inventor尹陈志林兴发杨智曹勇冯宇
OwnerHARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL