Thermal-Fluid-Solid Multi-Field Coupling Simulation Method Based on Micro-Scale Reconstruction Model

An analog method and micro-scale technology, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve the problems of limited macro-scale, etc., and achieve the effect of easy operation and simple realization process

An analog method and micro-scale technology, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve the problems of limited macro-scale, etc., and achieve the effect of easy operation and simple realization process

CN109063383AInactive Publication Date: 2018-12-21SOUTHWEST PETROLEUM UNIV

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  • Thermal-Fluid-Solid Multi-Field Coupling Simulation Method Based on Micro-Scale Reconstruction Model
  • Thermal-Fluid-Solid Multi-Field Coupling Simulation Method Based on Micro-Scale Reconstruction Model
  • Thermal-Fluid-Solid Multi-Field Coupling Simulation Method Based on Micro-Scale Reconstruction Model

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[0029] In order to facilitate the description of the basic theory, technical means and objectives of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present application in conjunction with the drawings in the embodiments of the present application and specific calculation cases. It should be noted that the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without other innovative efforts shall belong to the protection scope of the present application.

[0030] The method of the present invention utilizes rock micro-CT images to carry out a numerical analysis method for rock heat-fluid-solid multi-field coupling based on a micro-scale reconstruction model. The embodiment is described in detail in conjunction with the accompanying...

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Abstract

The present application discloses a Thermal-Fluid-Solid Multi-Field Coupling Simulation Method Based on a Micro-Scale Reconstruction Model. The method comprises the steps that: based on the reconstructed pore-scale structured mesh model of rock, by using rock micro-CT images, the mathematical model of solid-solid-three-field coupling is established, and the prediction of rock pore structure evolution and flow characteristics by stress and temperature change is realized through numerical simulation. Different from the traditional macro-scale heat-solid-solid coupling theory, this method is based on the reconstruction model of pore scale, and reveals the interaction mechanism of solid multi-field coupling. It is not only helpful to predict the effect of stress and temperature parameters on the development effect, but also to promote the research of multi-field coupling in geotechnical engineering, such as underground nuclear waste disposal, CO2 sequestration and geothermal development, which can better guide the engineering practice.

Description

technical field [0001] The invention relates to the technical field of rock physics, in particular to a rock heat-fluid-solid multi-field coupling simulation method using micro-CT images combined with micro-scale model reconstruction technology. Background technique [0002] Studies have shown that rocks in nature are a kind of strongly heterogeneous porous media, in which there are often fluid-solid coupling systems in which gas phase, liquid phase and solid phase interact. The fluid-solid coupling system plays an important role in controlling the macroscopic physical and mechanical properties of rocks and the transport characteristics of fluids. At the same time, such fluid-solid coupling systems are often controlled by temperature changes in nature. A large number of engineering practices have shown that in the construction of rock-related engineering fields such as oil and gas development, geothermal energy utilization, CO2 geological storage, hydropower and tunnels, the...

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Application Information

Patent Timeline
21 Dec 2018
Publication
CN109063383A
IPC
G06F17/50
CPC
G06F30/20
Inventors
宋睿; 汪尧