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A packaging structure of an OLED device and a display panel

An encapsulation structure and encapsulation cover technology, which are applied in the manufacturing of electric solid devices, semiconductor devices, semiconductor/solid state devices, etc., can solve the problems of being corroded by water and oxygen, reducing the service life of OLED devices, and air bubbles, so as to improve the resistance to water and oxygen. performance, improved reliability, and extended service life

Inactive Publication Date: 2018-12-21
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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Problems solved by technology

However, since the cover glass and the substrate are in plane contact, if the two are uneven or there are foreign objects between them, the UV curing adhesive will not be completely pressed together during the pressing process, resulting in cracks or cracks. The phenomenon of air bubbles, and even if the UV curing adhesive that is fully pressed and opened is cured by ultraviolet light, it will shrink and form broken lines, which makes the internal organic materials bear the risk of being corroded by water and oxygen. , thus reducing the reliability of the OLED device packaging, thereby reducing the water and oxygen resistance of the OLED device and reducing the service life of the OLED device

Method used

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  • A packaging structure of an OLED device and a display panel
  • A packaging structure of an OLED device and a display panel
  • A packaging structure of an OLED device and a display panel

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Embodiment Construction

[0026] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary, only used to explain the present invention, and should not be construed as a limitation of the present invention.

[0027] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc., or The positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplify...

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Abstract

The packaging structure of the OLED device provided by the invention comprises a substrate formed with the OLED device and a packaging cover plate arranged on the substrate; Wherein the package coverplate is provided with a first groove and a second groove, and the second groove is arranged around the first groove, the OLED device is arranged in the first groove, and the second groove is providedwith an adhesive material so that the package cover plate and the substrate formed with the OLED device are adhered and fixed. As that first groove and the second groove are arrange on the package cover plate, and the adhesive material is arrange in the second groove, the purpose of improving the reliability of the package of the OLED device is achieved, thus improving the water and oxygen resistance of the OLED device, and prolonging the service life of the OLED device.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a packaging structure of an OLED device and a display panel. Background technique [0002] At present, OLED (Organic Light Emitting Diode, organic light-emitting diode) realizes light emission by evaporating organic thin film materials and metal cathode materials on glass substrates coated with anode materials, but organic thin film materials are mainly sensitive to oxygen and water vapor in the atmosphere. , will fail due to chemical reactions, and the metal cathode material will also cause galvanic corrosion due to exposure to water vapor. Therefore, the OLED light-emitting area must be effectively isolated from water and oxygen by encapsulating the OLED device to prolong the working life of the OLED device. [0003] At present, the most commonly used encapsulation is mainly the ultraviolet (UV) curing sealant encapsulation method. However, since the cover glass and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52
CPCH10K50/846H10K50/841H10K50/8426
Inventor 张月
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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