A double-sided flexible board and an assembly fixture thereof

Abstract

The invention relates to a double-sided flexible board and an assembly fixture thereof. The flexible board comprises a flexible board body, wherein the flexible board body adopts a double-panel structure; A main via region and a standard pad region are arranged on the front face of the flexible board body, a group of electrical networks is arranged in the main via region corresponding to the electrical networks of optical device pins to be manufactured or tested, and a group of electrical networks corresponding to the main via pads is arranged in the standard pad region. A test pad area is arranged on the back surface of the flexible board body, and a group of test pads corresponding to the standard pad electrical network are arranged in the test pad area. The invention has the advantagesthat the double panel structure is adopted, the space is fully utilized, the test pad area is arranged on the back side, the reliability and the yield of the flexible soft board body test are not required to be met under the condition of expanding the non-standard pad area, and the test standard of the industry can be met.

Description

technical field [0001] The invention relates to the technical field of optical communication, in particular to a double-sided flexible soft board and an assembly fixture thereof. Background technique [0002] At present, in the manufacturing process of rigid printed circuit board (Printed Circuit board, PCB), flexible circuit board (FlexiblePrinted Circuit, FPC) or soft and hard board, it is necessary to carry out circuit layout design and components (such as resistors, capacitors, integrated circuit, etc.) layout design, and then perform circuit wiring according to a preset path and form a pad at a preset position. In the case of limited space and volume, and with the development trend of high integration of optoelectronic devices and communication modules, the size specified by industry standards is getting smaller and smaller. The size of the flexible board is also getting smaller and smaller, and the pads are becoming more and more dense; in this way, in the process of ...

AI Technical Summary

Problems solved by technology

And because the flexibility of multi-layer boards is much lower than that of single-layer boards, in the multi-process production and testing of optoelectronic devices and modules, repeated positioning and assembly will cause damage to flexible boards, which not only affects appearance, but also affects performance, leading to the use of flexible boards. Board products must be replaced with new flexible boards at high temperatures before they are sold. During the high temperature replacement process, it is easy to cause damage to the product again and cause it to fail.

Due to the above defects in flexible boards with high-density pads and their press-fitting methods, optoelectronic devices and communication modules are damaged or fail during the manufacturing and testing process, and the defect rate increases

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