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Method for preparing flexible copper clad laminate

A technology of flexible copper-clad laminates and sinking copper, which is applied in the field of circuit boards, can solve the problems of inability to produce copper foil and low peel strength, and achieve the effects of improving peel strength, enhancing bonding force, and increasing bonding force

Inactive Publication Date: 2018-12-28
SHENZHEN KNQ SCI & TECH CO LTD
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0004] The purpose of the present invention is to provide a method for preparing a flexible copper-clad laminate, aiming to solve the problem of peeling between the copper foil and the substrate when directly depositing copper on the surface of the substrate to prepare the copper foil in the current method for preparing the flexible copper-clad laminate. Low strength, resulting in the inability to produce copper foil with a thickness of less than 3 μm by direct electroplating copper plating

Method used

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  • Method for preparing flexible copper clad laminate

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Embodiment Construction

[0029] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0030] In the description of the present invention, it should be understood that the terms "first" and "second" are used for description purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0031] An embodiment of the present invention provides a method for ...

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Abstract

The present invention provides a method for preparing a flexible copper clad laminate. The flexible copper clad laminate comprising a base film layer, a sputter layer disposed on at least one surfaceof the base film layer, and a conductive copper foil arranged on the surface of the sputter layer, wherein the copper foil is disposed on the surface, away from the substrate film layer, of the sputter layer. The method for preparing the flexible copper clad laminate comprises the steps of: providing a base film layer, conducting corona treatment on the surface of the base film layer to obtain a surface-modified base film layer; depositing copper on the surface of the surface-modified base film layer through magnetron sputtering to form a sputter layer; and electroplating copper on the surfaceof the sputter layer to prepare a copper foil, wherein the copper electroplating is realized by two times of acid copper precipitation processes.

Description

technical field [0001] The invention belongs to the technical field of circuit boards, in particular to a method for preparing a flexible copper-clad board. Background technique [0002] Flexible printed circuit boards are products that are designed and produced with circuit graphics on flexible substrates by printing. As a special functional unit applied to electronic interconnection, due to its light weight, ultra-thin, small size, good flexibility, especially the outstanding advantages of being bendable, curly and foldable, flexible printed circuit boards have gained a lot of attention in the modern electronics industry. Wide range of applications. Especially in recent years, with the continuous improvement of people's requirements for the miniaturization, light weight and integration of electronic appliances, flexible circuit boards have become one of the indispensable components in the manufacture of various high-tech electronic products, and are widely used in noteboo...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35C23C14/20C23C14/02C23C28/02C25D3/38C25D5/10
CPCC23C14/022C23C14/205C23C14/352C23C28/021C25D3/38C25D5/10
Inventor 由龙
Owner SHENZHEN KNQ SCI & TECH CO LTD
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