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Packaging method for biological characteristic optical sensor of wearable equipment

A technology of optical sensor and packaging method, which is applied in the field of optoelectronics, can solve problems affecting user experience, module occupancy, large space, etc., and achieve the effects of reducing space occupancy, increasing integration, and good use effect

Active Publication Date: 2019-01-01
深圳市泓亚智慧电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For existing optical sensors, in order to obtain a better signal and reduce noise interference, the transmitting and receiving components are separated, resulting in the final module occupying a large space, and there will be problems when installed on a wearable smart watch or bracelet. Some protruding parts, which affect the user experience for smart wear solutions that require close contact with the skin to obtain accurate measurements

Method used

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  • Packaging method for biological characteristic optical sensor of wearable equipment

Examples

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Comparison scheme
Effect test

Embodiment 1

[0036] A method for encapsulating a biometric optical sensor of a wearable device, comprising the following specific steps:

[0037] Circuit arrangement step 100: use the resin-based copper-clad laminate to arrange circuit grooves around the functional area of ​​the resin-based copper-clad laminate according to the integrated function of transmitting and receiving.

[0038] Specifically, a resin-based copper-clad laminate is selected. Since the resin-based copper-clad laminate has a high glass transition temperature, excellent dielectric properties, low thermal expansion rate, and good mechanical properties, the resin-based copper-clad laminate is selected as the package. According to different needs, line grooves are arranged on the resin-based copper-clad laminates. Each resin-based copper-clad laminate has several windows, and the resin-based copper-clad laminates are also preset with cutting lines. Specifically, the size of the resin-based copper-clad laminate is selected ...

Embodiment 2

[0051] A method for encapsulating a biometric optical sensor of a wearable device, comprising the following specific steps:

[0052] Circuit arrangement step 100: use the resin-based copper-clad laminate to arrange circuit grooves around the functional area of ​​the resin-based copper-clad laminate according to the integrated function of transmitting and receiving.

[0053] Specifically, a resin-based copper-clad laminate is selected. Since the resin-based copper-clad laminate has a high glass transition temperature, excellent dielectric properties, low thermal expansion rate, and good mechanical properties, the resin-based copper-clad laminate is selected as the package. According to different needs, line grooves are arranged on the resin-based copper-clad laminates. Each resin-based copper-clad laminate has several windows, and the resin-based copper-clad laminates are also preset with cutting lines. Specifically, the size of the resin-based copper-clad laminate is selected ...

Embodiment 3

[0068] A method for encapsulating a biometric optical sensor of a wearable device, comprising the following specific steps:

[0069] Circuit arrangement step 100: use the resin-based copper-clad laminate to arrange circuit grooves around the functional area of ​​the resin-based copper-clad laminate according to the integrated function of transmitting and receiving.

[0070] Specifically, a resin-based copper-clad laminate is selected. Since the resin-based copper-clad laminate has a high glass transition temperature, excellent dielectric properties, low thermal expansion rate, and good mechanical properties, the resin-based copper-clad laminate is selected as the package. According to different needs, line grooves are arranged on the resin-based copper-clad laminates. Each resin-based copper-clad laminate has several windows, and the resin-based copper-clad laminates are also preset with cutting lines. Specifically, the size of the resin-based copper-clad laminate is selected ...

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PUM

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Abstract

The invention provides a packaging method for a biological characteristic optical sensor of wearable equipment, and the method comprises the following specific steps: a circuit arrangement step, a wafer welding step, a wire bonding step and a cutting step. The line arrangement is performed around a die bonding function region on a resin substrate copper-clad plate according to the transmitting andreceiving integrated function, and a wafer is welded in the die bonding function region. A chip motor on the wafer is connected with a bonding wire function region on the resin substrate copper-cladplate through the bonding wire, thereby realizing the electrical conduction of the chip. By cutting the resin substrate copper-clad plate into sensor units, each sensor unit includes at least one transmitting window and one receiving window, thereby realizing the integration of transmitting and receiving well, preventing the entire sensor unit from occupying a large space, greatly reducing the space occupancy rate of the sensor and improving the integration. When the sensor unit is mounted on a wearable smart watch or bracelet, the use effect is better.

Description

technical field [0001] The invention relates to the field of optoelectronics, in particular to a packaging method for a biometric optical sensor of a wearable device. Background technique [0002] With the development of technology and the improvement of living standards, people are more and more concerned about their own health and medical measurement methods that can be integrated into so-called wearable gadgets such as watches, smartphones or fitness bands. Interest, which promotes the development of smart health monitoring equipment. The optical approach is economically advantageous because the new technology of high-efficiency LEDs enables more energy-efficient and more compact sensors. At present, optical sensors can directly measure human biological characteristics such as heart rate, blood oxygen saturation, and blood pressure, and are used in modern fitness tracking and health monitoring, so there is a broad market space. [0003] The non-invasive detection of phy...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56H01L21/78H01L23/31A61B5/00
CPCA61B5/6801A61B5/681H01L21/561H01L21/78H01L23/3121
Inventor 叶又保
Owner 深圳市泓亚智慧电子有限公司
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