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A package bracket suitable for side-emitting deep ultraviolet LEDs and its production process

A technology of LED packaging and production process, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as limitations, and achieve the effect of improving service life, improving heat dissipation, and not easy to fall off

Active Publication Date: 2019-12-17
江西力特康光学有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When this type of deep ultraviolet LED is applied, the bottom electrode 30 ′ is usually fixed to the mounting surface, and at the same time realizes mechanical connection and electrical connection. If the side opposite to the mounting surface is used as the front, the deep ultraviolet LED in the prior art can only For positive light emission, this fixed light-emitting method has obvious limitations on the wide application of deep ultraviolet LEDs

Method used

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  • A package bracket suitable for side-emitting deep ultraviolet LEDs and its production process
  • A package bracket suitable for side-emitting deep ultraviolet LEDs and its production process
  • A package bracket suitable for side-emitting deep ultraviolet LEDs and its production process

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Embodiment Construction

[0036] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0037] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0038] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0039] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention discloses a side light-emitting deep ultraviolet LED packaging bracket and a production process thereof, the production process includes forming aluminum nitride slurry, injecting it into a base layer mold to form an aluminum nitride base layer; forming a metal layer on the surface of the aluminum nitride base layer; arranging a metal electrode block in a preset electrode region on the metal layer; covering layer of aluminum nitride paste on the metal layer to form an aluminum nitride substrate embryo body; The aluminum nitride substrate embryo is sintered and annealed at high temperature to form an aluminum nitride ceramic structure; The aluminum nitride ceramic structure is laser drilled in each die bonding region on the first surface on the side of the second enclosure damto form a hole from the first surface to the metal layer, and the hole is filled with a metal material; A circuit is formed by photolithography on the first surface according to a preset circuit, anda plurality of independent aluminum nitride ceramic supports are formed after cutting. By the invention, the deep ultraviolet LED lateral light emission can be realized.

Description

technical field [0001] The invention relates to the technical field of deep ultraviolet LED packaging, and more particularly relates to a package bracket suitable for side-emitting deep ultraviolet LEDs and a production process thereof. Background technique [0002] At present, deep ultraviolet LED has a very broad application prospect, especially in the field of sterilization and medical treatment, which has an irreplaceable role. [0003] Deep ultraviolet LEDs usually include a body and a packaged ceramic bracket, figure 1 It is a schematic diagram of the structure of the ceramic bracket in the prior art. The ceramic bracket commonly used in the industry is produced by the following process: [0004] Firstly, the circuit layout is made on the front of the ceramic substrate 10', and then a metal material, such as an alloy of copper, iron, aluminum and magnesium, is used to make the cavity dam 20'; the bottom electrode 30' on the back of the ceramic substrate 10' is also ma...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/00
CPCH01L33/005H01L33/48
Inventor 林辉王博文刘召忠蓝文新
Owner 江西力特康光学有限公司
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