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A circuit board insulating and heat insulating coating is disclosed

A technology of insulation and heat insulation, circuit board, applied in circuit heating device, printed circuit components, printed circuit dielectric and other directions, can solve the problems of poor insulation and heat insulation effect, easy to cause fire, circuit board burning, etc.

Active Publication Date: 2019-01-08
ANHUI UNIVERSITY OF ARCHITECTURE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, in the existing circuit board insulation and heat insulation coating, there is a problem of poor insulation and heat insulation effect.
Often, the hea

Method used

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  • A circuit board insulating and heat insulating coating is disclosed

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Embodiment 1

[0020] The invention relates to an insulating and heat-insulating coating for a circuit board. The raw materials are respectively 50% ethanol, 30% modified base material, 10% polydimethylsiloxane, and 5% hydroxypropyl Methylcellulose, 3% trimethylhexamethylenediamine and 2% 2,4,6-tris(dimethylaminomethyl)phenol.

[0021] Wherein, the percentage by weight of each raw material in the modified base material is 62.5% of bismaleimide resin, 15% of polysiloxane, 15% of ceramic microbeads and 7.5% of butyl titanate.

[0022] The modified base material is prepared according to the following process: first mix bismaleimide resin, polysiloxane and ceramic microbeads, and carry out the initial uniform stirring and heating operation, and the initial stirring time is controlled at 50 minutes. The stirring temperature is controlled at 110 degrees, then butyl titanate is added, pressurized at 1.3Mpa, and the second uniform stirring and heating operation is performed, and the second stirring ...

Embodiment 2

[0029] The invention relates to an insulating and heat-insulating coating for circuit boards. The raw materials are 55% ethanol, 27.5% modified base material, 7% polydimethylsiloxane, and 3.5% hydroxypropyl Methylcellulose, 4% trimethylhexamethylenediamine and 3% 2,4,6-tris(dimethylaminomethyl)phenol.

[0030] Wherein, the percentage by weight of each raw material in the modified base material is 62.5% of bismaleimide resin, 15% of polysiloxane, 15% of ceramic microbeads and 7.5% of butyl titanate.

[0031] The modified base material is prepared according to the following process: first mix bismaleimide resin, polysiloxane and ceramic microbeads, and carry out the initial uniform stirring and heating operation, and the initial stirring time is controlled at 50 minutes. The stirring temperature is controlled at 110 degrees, then butyl titanate is added, pressurized at 1.3Mpa, and the second uniform stirring and heating operation is performed, and the second stirring time is con...

Embodiment 3

[0038] The invention relates to an insulating and heat-insulating coating for a circuit board. The raw materials are 57.5% ethanol, 25% modified base material, 6% polydimethylsiloxane, and 5.5% hydroxypropyl Methylcellulose, 3.5% trimethylhexamethylenediamine and 2.5% 2,4,6-tris(dimethylaminomethyl)phenol.

[0039] Wherein, the percentage by weight of each raw material in the modified base material is 62.5% of bismaleimide resin, 15% of polysiloxane, 15% of ceramic microbeads and 7.5% of butyl titanate.

[0040] The modified base material is prepared according to the following process: first mix bismaleimide resin, polysiloxane and ceramic microbeads, and carry out the initial uniform stirring and heating operation, and the initial stirring time is controlled at 50 minutes. The stirring temperature is controlled at 110 degrees, then butyl titanate is added, pressurized at 1.3Mpa, and the second uniform stirring and heating operation is performed, and the second stirring time i...

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Abstract

The invention discloses an insulating and heat insulating coating for circuit board, wherein the weight percentage of each raw material is 50-65% ethanol, 20-30% modified binder, 4-10% polydimethylsiloxane, 3-7% hydroxypropyl methyl cellulose, 2-5% trimethylhexamethylene diamine and 1-3% of 2, 4, 6-Tris (dimethylaminomethyl) phenol; The ceramic beads in the modified base material can emit heat onthe surface of the object at a certain wavelength, and a vacuum cavity group composed of substances in the dry film layer, At the same time, most of the polysiloxane in the modified base material willmigrate to the surface of the object after coating, forming a polymer gradient material whose surface is an enriched layer. Once the heat is too high or combustion occurs, an inorganic oxygen insulation protection layer containing Si bonds and Si-C bonds of the polysiloxane will be generated so as to achieve the effect of flame retardancy. Compared with the existing, the insulation and heat insulation effect of the insulation and heat insulation coating of the circuit board has been significantly improved, and the insulation and heat insulation coating has the ability of flame retardancy, andhas strong practicability.

Description

technical field [0001] The invention relates to the technical field of circuit board coating, in particular to a circuit board insulation and heat insulation coating. Background technique [0002] The circuit board can also be called a printed circuit board or a printed circuit board, which has the characteristics of high wiring density, light weight, thin thickness, high reliability and good bendability. The names of circuit boards include ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, circuit boards, aluminum substrates, high-frequency boards, thick copper boards, and impedance boards. The circuit board makes the circuit miniaturized and intuitive. Mass production of fixed circuits and optimization of consumer layout play an important role. During the manufacturing process of the circuit board, its external coating also determines the service life of the circuit board to a certain extent. [0003] However, in the existing...

Claims

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Application Information

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IPC IPC(8): H05K1/02
CPCH05K1/0209H05K2201/0137
Inventor 郑长勇
Owner ANHUI UNIVERSITY OF ARCHITECTURE
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