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Flexible circuit board glue device and flexible circuit board production equipment

A technology for flexible circuit boards and gluing devices, which is applied to printed circuits, printed circuit manufacturing, electrical components, etc., and can solve problems such as low processing efficiency

Inactive Publication Date: 2019-01-08
王朝火
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The processing of flexible printed circuit boards includes steps such as wire cleaning, feeding, gluing, and cutting. The existing processing methods are operated separately, and the processing efficiency is low.

Method used

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  • Flexible circuit board glue device and flexible circuit board production equipment
  • Flexible circuit board glue device and flexible circuit board production equipment
  • Flexible circuit board glue device and flexible circuit board production equipment

Examples

Experimental program
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Effect test

Embodiment Construction

[0040] Combine below Figure 1-Figure 21 The present invention is further described.

[0041] Such as Figure 1-Figure 21 The flexible circuit board production equipment shown includes a wire feeding and feeding device 1, a wire ultrasonic cleaning device 2, a flexible circuit board gluing device 3, a laser cutting and peeling device 4, a wire cutting and receiving device 5 and a frame 6 . Wire feeding and feeding device 1, wire ultrasonic cleaning device 2, flexible circuit board gluing device 3, laser cutting and peeling device 4, and wire arranging, cutting and receiving device 5 are sequentially connected, wire ultrasonic cleaning device 2, flexible circuit board gluing The device 3 , the laser cutting and peeling device 4 and the cable cutting and receiving device 5 are installed on the frame 6 .

[0042] The feeding wire feeding device 1 is used for sorting wire rods and feeding them into the wire rod ultrasonic cleaning device 2, and the wire rods are copper enameled...

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PUM

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Abstract

The invention relates to the production technical field of a flexible printed circuit board. A flexible circuit board gluing device comprising a frame, a first lead mechanism, a comb mechanism, a scraping and carding mechanism, a gluing mechanism and a glue pressing mechanism; The first lead mechanism is installed in the wire comb mechanism, and the wire comb mechanism, the wire scraping and carding mechanism, the glue sticking mechanism and the glue pressing mechanism are installed on the frame. The advantages of the flexible circuit board glue pasting device are that the wire feeding, wire finishing, glue pasting and compaction operations are automatically completed.

Description

technical field [0001] The invention relates to the technical field of production of flexible printed circuit boards. Background technique [0002] Flexible printed circuit boards are mainly used in many products such as mobile phones, notebook computers, PDAs, digital cameras, and liquid crystal displays. The processing of flexible printed circuit boards includes steps such as wire cleaning, feeding, gluing, and cutting. The existing processing methods are operated separately, and the processing efficiency is low. Contents of the invention [0003] An object of the present invention is to provide a gluing device that automatically completes the wire feeding, wire sorting, gluing and compacting operations. Another object of the present invention is to provide a flexible circuit board production equipment that can automatically complete wire material feeding, wire cleaning, gluing, laser cutting, peeling, and material receiving. [0004] In order to achieve the above obje...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/00H05K2203/1545
Inventor 王朝火
Owner 王朝火
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