A rapid preparation method and device for fiber-reinforced resin-based composite laminates
A fiber-reinforced resin and composite material layer technology is applied in the field of rapid preparation of fiber-reinforced resin-based composite material laminates, and can solve the problems of increasing the production cycle of composite material laminates, high production costs, time-consuming and labor-intensive, etc.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0034] For laminates with the following process: vacuumize at room temperature to -0.095MPa, pressurize at 40°C to 0.4-1.2MPa, keep warm for 20-60min, keep the temperature at 110°C-130°C for 60-120min, cool down to room temperature, and prepare various process conditions Under the sample, test its mechanical properties to optimize the process. The main process conditions are shown in Table 1.
[0035] Table 1 Preparation process of a certain laminate
[0036]
[0037] The following methods can be used for rapid preparation:
[0038] 1) Lay the prepreg according to the preset layup sequence to obtain 13 preforms, vacuumize at room temperature, and the vacuum degree is not less than -0.095MPa.
[0039]2) Two stages of hot-pressing platform are adopted, the temperature of the first hot-pressing platform is set at 40°C, and the temperature of the second hot-pressing platform is set at 110°C. Put the 1# sample into the first hot-pressing platform, pressurize at 0.4MPa, and ke...
Embodiment 2
[0043] For laminates with the following process: vacuumize at room temperature to -0.095MPa, hold at 80°C for 20-60 minutes, hold at 130°C for 30 minutes, hold at 190°C for 60-120 minutes, cool down to room temperature, and prepare samples under various process conditions for use in Test its mechanical properties to optimize the process.
[0044] The following methods can be used for rapid preparation:
[0045] 1) Lay the prepreg according to the preset layup sequence to obtain multiple preforms, vacuumize at room temperature, and the vacuum degree is not less than -0.095MPa.
[0046] 2) Adopt 3-stage heating platform, the temperature of the first heating platform is set at 80°C, the temperature of the second heating platform is set at 130°C, and the third heating platform is set at 190°C.
[0047] 3) According to the different preparation processes planned, samples of different processes can be obtained by adjusting the residence time of the preform on the three heating plat...
Embodiment 3
[0049] For laminated boards with the following process: pressurize 0.1-0.3MPa at 110°C and keep warm for 30min. Pressurize 0.4-0.8MPa at 170°C, hold for 60min, cool down to room temperature, and prepare samples under various process conditions for testing their mechanical properties to optimize the process.
[0050] The following methods can be used for rapid preparation:
[0051] 1) Lay the prepreg according to the preset layup sequence to obtain multiple preforms.
[0052] 2) A heating platform and two hot-pressing platforms are used to complete the process. The temperature of the heating platform is set at 80°C, the temperature of the first hot-pressing platform is set at 110°C, and the temperature of the second hot-pressing platform is set at 170°C.
[0053] 3) The preform is pre-heated on the heating platform first, and then enters the first hot-pressing platform and the second hot-pressing platform in turn. According to the different preparation processes planned, the p...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More - R&D
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com


