A DBR structure plate on that back of a blue LED chip and a preparation method thereof
A LED chip and back-plating technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve problems such as color difference, shedding, and shorten the evaporation process time, so as to simplify the film structure, balance production efficiency, and shorten the evaporation process. The effect of process time
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[0017] The technical solution of the present invention will be described in detail below in conjunction with the examples. The present invention discloses a back-coated DBR film structure of a blue LED chip. Similar to the prior art, the DBR film structure is back-plated on the back of the LED chip. Different from the prior art, the DBR film system has 20 layers, and the DBR film system is an irregular film system, and each layer of the DBR film system has a different corresponding center wavelength. The DBR film is made of SiO 2 、TiO 2 The two materials are alternately stacked, and the optical thickness of each layer of alternately grown materials is a quarter of the central wavelength of the corresponding film system. The total thickness of the finally formed DBR film system is about 1600nm.
[0018] The preparation method of a kind of blue light LED chip back-plated DBR film system structure described above comprises the following steps,
[0019] S1. Prepare the substrat...
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