An isothermal integrated cooling device suitable for micro-nano satellites

Abstract

The invention relates to an isothermal integrated heat dissipation device suitable for micro-nanosatellite, in particular to an isothermal integrated heat dissipation device for realizing isothermal inside the satellite by adopting an external heat pipe and a copper plate with high thermal conductivity. The utility model particularly comprises a heat dissipation plate and an outer cabin plate of the satellite with heat dissipation fins; An isothermal copper plate mounted on the inner surface of the structural plate; L-shaped external heat pipes, the number of which is two; Intermediate partition, inside the satellite. The invention has the following beneficial effects: (1) the heat of the high heat consumption single machine equipment can be rapidly and uniformly diffused to the heat dissipation plate through the isothermal copper plate and then radiated out; (2) isothermal copper plate realizes isothermalization on the radiating plate, and heat pipe conducts heat to the intermediate separator to realize isothermalization of the isothermic copper plate and the intermediate separator; (3) when there is a high heat consumption single machine not working, the heat of other single machines can be conducted, and the active heating is not needed, thus saving the energy on the satellite; (4) The thermal control products used are all passive thermal control products with high reliability and strong process realizability.

Description

technical field [0001] The invention relates to an isothermal integrated heat dissipation device suitable for micro-nano satellites, in particular to an isothermal integrated heat dissipation device that uses an externally attached heat pipe and a copper plate with high thermal conductivity to achieve isothermalization inside the satellite. Background technique [0002] With the rapid development of electronic technology, the single-machine manufacturing of electronic equipment is getting smaller and smaller. Small satellites also benefit from the development of electronic technology, and their quality and volume are getting smaller and smaller. Micro-nano satellites integrate many electronic devices, which can realize the function. The integrated development of micro-nano satellites has brought about the problem of satellite thermal control. Due to the small size of electronic equipment and high heat consumption, and the structural panels of satellites are generally compose...

AI Technical Summary

Problems solved by technology

[0004] The technical problem solved by the present invention is: to overcome the deficiencies of the prior art, to provide an isothermal integrated heat dissipation device suitable for micro-nano satellites, and to solve the problem of high heat consumption, high local heat flux of single machine and high heat flow outside the satellite, which are currently faced by micro-nano satellites. drastic changes

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